Kontron CP6001-R3, Руководство пользователя

Страница: 19 / 30

CP6001-R3 Introduction
ID 1027-2047, Rev. 1.0 Page 1 - 3
1. Introduction
1.1 Board Overview
The CP6001-R3 is a highly integrated, ruggedized, conduction cooled, 6U CompactPCI CPU
board based on the Intel® Core™ Duo and the Intel® Core™2 Duo microprocessors combined
with the high-performance Mobile Intel® 945GM Express Chipset.
The board is capable of supporting the Intel® Core™ Duo and the Intel® Core™2 Duo
processor versions in 65 nm technology with 64 kB L1 and up to 4 MB L2 cache in a 479
µFCBGA package with frequencies of 1.2 GHz and 1.5 GHz providing 533/667 MHz front side
bus speed. The CP6001-R3 utilizes the Mobile Intel® 945GM Express Chipset as Graphics
Memory Controller Hub and the ICH7R as I/O Controller Hub.
The board includes up to 4 GB of soldered, dual-channel Double Data Rate 2 (DDR2) memory.
The DDR2 memory operates at 533/667 MHz, depending on the CPU. A soldered Compact-
Flash solution is implemented via an IDE Flash controller combined with a NAND Flash mem-
ory.
The CP6001-R3 offers a complete set of data, communication and multimedia interfaces, such
as one onboard Parallel ATA interface connected to the soldered CompactFlash. Rear I/O in-
terfacing includes: two Gigabit Ethernet ports (Intel® 82573L) in accordance with the PICMG
CompactPCI Packet Switching Backplane Specification 2.16, four Serial ATA interfaces, a
high-resolution VGA interface (CRT), a DVI interface and an HDMI interface via dedicated
SDVO transmitters, a single CCPMC interface with 32-bit/66 MHz with rear I/O interfacing only.
In addition, four USB 2.0 ports are available and two COM ports, one RS-232 port and one RS-
422 port all on rear I/O.
The CP6001-R3 provides safety and security via a Trusted Platform Module (TPM) 1.2, two re-
dundant firmware hubs (FWH) and Intelligent Platform Management Interface (IPMI) support.
Designed to withstand even the toughest environmental conditions, the conduction cooled
CP6001-R3 comes in the rugged level R3 and is available with extended temperature capabil-
ities and also provides support for a CCPMC. It includes a heat spreader extending across the
whole board which enables the heat to be conducted from the board to the chassis, and two
wedge locks for mounting the board in the chassis.
Designed for stability and packaged in a rugged format, the board fits into all applications
situated in industrial environments, including I/O intensive applications where only one slot is
available for the CPU, making it a perfect core technology for long-life applications.
Components with high temperature tolerance have been selected from embedded technology
programs, and therefore offer long-term availability.
The board is offered with Microsoft® Windows® XP, Windows® XP Embedded, Linux, and
VxWorks operating systems. Please contact Kontron for further information concerning the
operation of the CP6001-R3 with other operating systems.