D R A F T — F O R I N
T E R N A L U S E O N L Y
8
www.kontron.com
User Guide
CP6108X/CP6-GPU8860
1 Introduction
1.1 Board Over view
The CP6108X is
a 6U high-speed CompactPCI® carrier for an MXM3.0 GPU module and has been de-
signed to integrate leading-edge, parallel processing capabilities into CompactPCI® systems. It can
accommodate one MXM3.0 type A or type B module with an AMD Radeon™ GPU designed for the embed-
ded industry or any other customer-sourced MXM3.0 GPU module.
The CP6108X combines enormous price-performance and performance-per-watt advantages of GPU and
GPGPU computing with the robustness, longevity, and modularity of CompactPCI® systems. This is the
perfect symbiosis not only for some of the most demanding graphics-intensive applications in modular
or rugged systems, but also for enhanced workload and massive parallel computing in harsh environ-
ments. Typical sample applications in avionics are geographic information systems, 360-degree situ-
ational awareness, and diminished vision enhancement. Typical public- and government-related tasks
are radar, sonar, or video surveillance and FFT calculations.
On request, Kontron provides assistance in developing suitable customer-specific cooling solutions for
the CP6108X for use with various MXM3.0 modules. For MXM3.0 type A modules in conjunction with the
CP6108X, Kontron offers a specifically designed heat sink solution. It is the responsibility of the sys-
tem integrator to ensure that sufficient cooling is provided when operating the CP6108X equipped with
an MXM3.0 module.
The CP6108X is also available with the AMD Radeon E8860 GPU module mounted (this assembly here-
inafter referred to as CP6-GPU8860). The CP6-GPU8860 comes with an optimized passive cooling solu-
tion, which is a reference for solutions to any other MXM3.0 type A module for use with the CP6108X.
An active fansink is avoided on board level to increase system ruggedization for harsh environments.
This cooling solution saves valuable board space while the entire assembly still fits to only 4HP height.
For further information on the CP6-GPU8860, refer to Chapter 5.
The high-speed serial I/O interconnection (PICMG2.20) enables high data throughput via PCI Express®
within the system. Data stream conversion by the CP6108X from x8 PCI Express 2.1 (MXM) to x8 or x4
PCI Express® 3.0 (system), if required, allows for maximum possible data bandwidth with respect to
the capabilities of the selected CPU.
