14
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User Guide
COMe Ref. Carrier-i T10 TNI
Sy
st
em Inte
rf
aces
SIM
microSD/SIM combo socket, J20, connected to both Mini PCIe interfaces
I
2
C
I
2
C interface via 15-pin SYS_Signals / embedded interfaces pin header, J6
SMBus
SMBus interface via 15-pin SYS_Signals / embedded interfaces pin header, J6
LID/SLEEP
LID/SLEEP signals via 15-pin SYS_Signals / embedded interfaces pin header, J6
CPU Fan
One 4-pin PWM fan connector, J2
LEDs
Two status LEDs available via the front panel connector, J5:
» Power LED
» HDD Activity LED
Swit
ch
DIP Switch
One 8-position DIP switch, SW1, for board configuration
Po
w
er
S
up
pl
y
an
d
Ma
na
ge
me
nt
Power Supply
Power input 1: 12V only
Power input 2: 6.5V - 30V wide input range
SMART battery: 7.2V - 8.4V
Power / Reset Button
Available via the front panel connector, J5
RTC
2-pin connector for external CMOS battery, J14
Goldcap for RTC backup, C181
Gener
al
BIOS
Via COMe mini Type 10 module
Temperature Range
Operational: -40°C to +85°C
Storage:
-40°C to +85°C
Note:
When additional components are installed, refer to their operational
specifications as this will influence the operational and storage
temperature of the COMe Ref. Carrier-i T10 TNI.
Climatic Humidity
93% RH at 40 °C, non-condensing (acc. to IEC 60068-2-78)
Form Factor
COM Express® carrier, pinout Type 10, Thin-nITX form factor
Dimensions
120 mm x 120 mm (nITX)
Max. component height:
Top side:
16.5 mm
Bottom side: 4.0 mm
Table 3: COMe Ref. Carrier-i T10 TNI Main Specifications (Continued)
FEATURES
SPECIFICATIONS