(No.XA002)1-45
39-40
I/O
DQ21~22
Multiplexed pins for data out put and input.
41
-
VccQ
Separated power from VCC, to improve DQ noise immunity. (+3.3V)
42
I/O
DQ23
Multiplexed pins for data out put and input.
43
-
Vcc
Power for input buffers and logic circuit inside DRAM. (+3.3V)
44
-
Vss
Ground for input buffers and logic circuit inside DRAM.
45
I/O
DQ24
Multiplexed pins for data out put and input.
46
I/O
VssQ
Separated power from VSS, to improve DQ noise immunity.
47-48
I/O
DQ25~26
Multiplexed pins for data out put and input.
49
-
VccQ
Separated power from VCC, to im prove DQ noise immunity. (+3.3V)
50-51
I/O
DQ27~28
Multiplexed pins for data out put and input.
52
I/O
VssQ
Separated power from VSS, to improve DQ noise immunity.
53-54
I/O
DQ29~30
Multiplexed pins for data out put and input.
55
-
VccQ
Separated power from VCC, to improve DQ noise immunity. (+3.3V)
56
I/O
DQ31
Multiplexed pins for data out put and input.
57
-
NC
No connection
58
-
Vss
Ground for input buffers and logic circuit inside DRAM.
59
I/O
DQM3
The output buffer is placed at Hi-Z (with latency of 2) when DQM is sampled high in read cycle.
In write cycle sampling DQM high will block the write operation with zero latency.
60-66
-
A3~A9
Multiplexed pins for row and column address. Row address: Ao-A10. Column address:A0-
A7.A10 is sampled during a recharge command to determine if all banks are to be recharged
or bank selected by BS0, BS1.
67
-
CKE
CKE controls the clock activation and deactivation. When CKE is low, Power Down rising edge
of clock.
68
I
CLK
System clock used to sample inputs on the rising edge of clock.
69-70
-
NC
No connection
71
I/O
DQM1
The output buffer is placed at Hi-Z (with latency of 2) when DQM is sampled high in read cycle.
In write cycle, sampling DQM high will block the write operation with zero latency.
72
-
Vss
Ground for input buffers and logic circuit inside DRAM.
73
I/O
NC
No connection
74
I/O
DQ8
Multiplexed pins for data out put and input.
75
I/O
VccQ
Separated power from VCC, to improve DQ noise immunity. (+3.3V)
76-77
I/O
DQ9~10
Multiplexed pins for data out put and input.
78
I/O
VssQ
Separated power from VSS, to improve DQ noise immunity.
79-80
I/O
DQ11~12
Multiplexed pins for data out put and input.
81
I/O
VccQ
Separated power from VCC, to improve DQ noise immunity. (+3.3V)
82-83
I/O
DQ13~14
Multiplexed pins for data out put and input.
84
I/O
VssQ
Separated power from VSS, to improve DQ noise immunity.
85
I/O
DQ15
Multiplexed pins for data out put and input.
86
-
Vss
Ground for input buffers and logic circuit inside DRAM.
Pin No.
I/O
Symbol
Function
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