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-10-
D) Manual Process (User define heaters power level)
-
Adjust the PCB to the XY table out of operation area.
-
Every time you power ON the machine you should leave the Lower Heater at
100% 2 min until the Guard Glass become saturated with heat.
-
You should align the PCB using the Laser pointer so that the pointer will be in
the center of the desired component.
-
Make sure that the machine is situated in Park Mode.
-
Put the Thermocouple
(TC)
in any place near to the desired component.
-
Adjust the lower Heater to the desired power level.
-
If you have any component which can be affected or damaged by excess heat,
you should cover it with reflective tape to prevent Infrared rays to reach it.
-
Pre heat until the PCB reaches a temperature from 80
°
C to 120
°
C.
-
Adjust the upper heater to the desired power level then rotate the upper heater
so the machine enters the Normal Mode.
-
Monitor the screen until the PCB reaches a temperature between 180
°
C and
230
°
C.
-
Switch the Pump On to pick up the component (BGA, CSP, etc…) by the
suction pen or use any other removal tool like tweezers to remove other type of
components
(plastic parts, connectors, etc…).
-
Turn the machine to Park Mode and switch the Fan On (Fan Button) to start
the cooling stage.
Heaters power level could be changed during the running process.
From Main menu select
Manual Control
Adjust the U.H (upper
heater) and L.H (lower
heater) power levels
Press Ok to start the
process and cancel to
stop the process any
time.
Содержание RE-7550
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