JETWAY TIH77MG7, Руководство пользователя

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2
1-2 Specification
Spec Description
Design
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U-ATX form factor;
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PCB size: 17.5 cm x 24.0 cm
Chipset
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Intel
®
H77 Express Chipset
CPU Socket
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supports 3
rd
and 2
nd
Generation Intel
®
Core™ i7, Core™ i5,
Core™ i3 series processor in LAG1155 Package
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Support Intel
®
Turbo Boost 2.0 Technology
z
Support Hyper-Threading Technology
* For more detailed CPU support information please visit our website
Memory Slot
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DDRIII module slot x 2
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Support 2pcs of DDRIII 800/1066/1333/1600 memory modules
expandable to 16 GB
z
Support dual channel function
Expansion Slots
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1 psc* PCI-Express x16 slot by 16 lane (This PCIE x 16 Slot
conforms to PCI Express 3.0 standard)
* Note:
PCI-Express 3.0 is supported with Intel® Ivy Bridge CPU. With
Intel® Sandy Bridge CPU, the slot only supports PCI-Express 2.0
specification)
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1 pcs * PCI-Express 2.0 x1 slot
SATAII & SATAIII
1. Supports two SATAII ports and one Mini-SATA connector of
providing 3.0 Gb/sec data transfer rate and two SATAIII devices
providing 6.0 Gb/sec data transfer rate
2. Support RAID 0,1,5,10 function
LAN chip
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Integrated gigabit PCI-E LAN chip that supports Fast Ethernet LAN
function of providing 10/100/1000 Mbps data transfer rate
6HD Audio Chip
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6-CHHD Audio Codec integrated
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Audio driver and utility included
BIOS
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AMI 32MB DIP Flash ROM
Multi I/O
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PS/2 keyboard connector x1 and PS/2 mouse connector x1
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VGA connector x1
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HDMI connector x1
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USB 2.0 port x2 and USB 3.0 port x2
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RJ-45 LAN connector x1
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Audio connector x3 (Line-in/Line-out/MIC-in)
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USB 2.0 header x2 (support 4 additional USB 2.0 ports)
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USB 3.0 header x1 (support 2 additional USB 3.0 ports)
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Front panel audio Header x1
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HDMI-SPDIF header x1
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Front panel header x1
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PWELED header x1
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Speaker header x1
Item Checklist
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Intel
®
H77 chipset based motherboard
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DVD for motherboard utilities
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User’s manual
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SATA cable
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I/O back panel shield