8
right angle. Insert the CPU with the white dot as your guide. The white dot should point towards
the end of the level. The CPU has a corner pin for three of the four corners, the CPU will only fit
in the one orientation as shown as follow. With the added weight of the CPU fan, no force is
required to insert the CPU. Once completely inserted, hold down on the fan and close the
Socket’s lever.
IMPORTANT: You can setting the CPU ratio and Host Frequency in the BIOS setup on page
18
CPU ZIF Socket 370
Lock
So
ck
et 3
7
0
Blank
Lever
White Dot
So
cket
3
7
0
CP
U
2-7-3
Intel
®
Pentium
®
III Processor (256K) in the FC-PGA form factor: Mechanical Features
The FC-PGA package has the processor’s silicon die directly mounted to a pinned interposer substrate.
The pin grid array is partially populated and there may be surface mount components in the unpopulated
central area of the pin field.
Intel
®
Pentium
®
III Processor in the FC-PGA form factor: Mechanical Features
Reference Design: Heatsink
Substrate
Flip Chip Die
Pins
Fillet Epoxy
(Not to scale)
Flip-Chip Si Core
C4 Solder bumps
Surface mounted
pins
Fillet Epoxy
(Not to scale)
Multi-layer
substrate
FC-PGA with the reference
design heatsink
z
Intel’s reference design thermal solution is an
active heatsink; an extruded aluminum heatsink
base and a fan attached to the top on the fin
array.
•
Heatsinks for the PPGA will not work with the
FC-PGA. A pedestal is required on the
underside of the heatsink to clear the socket
cam box
z
Recommended thermal interface
material: Chomerics* XTS454.