11
Caution: ESD protection!
Avoid any electrostatic discharge and observe the rules for ESD protection. The
fitter, the workbench and the used tools must be grounded.
•
Mount the subassembly to an appropriate cooling unit with Peltier cooling
element by means of the screws (
6
,
7
,
9
or
12
,
Fig. 2, p. 9
).
The contact surface of the cooling unit must be sufficiently flat and clean.
The cooling capacity of the cooling unit depends on the operating mode.
For this, refer to -->
Specifications.
Dimension the cooling unit in such a way
that no overheating can occur.
Refer to -->
Fig. 3, p. 10
for information on the dimensions and the location of
the threaded holes to be cut into the cooling unit for fastening the subassembly.
•
Screw the three threaded bolts provided into the cooling unit, and carefully
attach the laser device.
Note:
To improve thermal transfer, we recommend the use of a thin, solvent-free
heat-conductive film.
The use of a commercial heat-conductive paste is not allowed, as its creep-
ing behavior as well as evaporating solvent may destroy the module.
•
Put the delivered spring onto each fastening bolts. The two thin springs have
to be inserted into the bores (
6
,
7
,
9
,
Fig. 2, p. 9
).
Then, screw down the device by means of the nuts (Max. torque:
10 cNm
for
6
,
7
;
40 cNm
for
9
).
•
To secure the mounting position, drill dowel bore (
8
) into the cooling unit
(approx.
6 mm
deep) to a diameter of
4 mm
. Then, secure the units by dowels.
When you mount an additional optical element to the front surface of the de-
vice, make sure that its weight does not exceed 500 g (Center of mass: max
150 mm in front of the front surface).
XH1
10 k
Ω
3.9 V, 2.3 A
LD
10 k
Ω
10 k
Ω
X2
X1
NTC/Diode
NTC/Diode
NTC/LBO
Peltier/LBO
LD-
1
2
3
4 PE-
5
6
7
8
9 PE+
+
(sw)
(rt)
Fig. 4
Pin assignment
•
Wire the connecting cable to the sub-D connector as illustrated in the ob-
ove-mentioned scheme.
Installation