3
ISOMET
Figure 2 shows a block diagram of the Driver.
The iMS4-L comprises two PCB
’s
Lower PCB features a four channel DDS and high speed FPGA with memory function.
Upper PCB is the main I/O interface and includes the USB II connection to the host
The -Enable signal is common to all four outputs. A closed contact between signal and ground will
enable the RF power amplifier. No external pull-up is required and if a voltage is applied to this pin it
must not exceed 3v3
The design includes thermal interlock protection which is also common to all four outputs
Each channel features a class A/B power stage to generate the final output level of up to 90W per
output.
Water cooling is required. The heatsink temperature must not exceed 70
C.
SERIOUS DAMAGE TO THE AMPLIFIER MAY RESULT IF THE TEMPERATURE
EXCEEDS 70
C.
SERIOUS DAMAGE TO THE AMPLIFIER MAY ALSO RESULT IF THE RF OUTPUT
CONNECTOR IS OPERATED OPEN-CIRCUITED OR SHORT-CIRCUITED.
SERIOUS DAMAGE TO THE AMPLIFIER WILL RESULT IF THE (FLOATING) INTERLOCK
INPUT SIGNALS ARE CONNECTED TO CHASSIS GROUND OR 0V
A low impedance d-c power supply is required. The operating voltage is +24V at a current drain of
approximately 32A. The external power supply should capable of > 40A, with
2% regulation and
<200mV ripple voltage for best results.
Figure 1 shows the connections.
