InvenSense MPU-9250, Руководство пользователя

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AN-MPU-x000A-01
Document Number: AN-MPU-x000A-01 Page 12 of 14
Revision: 1.1
Date: 06/12 /2015
6. QUICK REFERENCE
This section is added a brief listing of PCB design guidelines which may be used in review when defining device placement. This list is
not complete, nor reflects all information provided within this document.
DESCRIPTION ISSUE CORRECTIVE ACTION
Magnetic Distortion
Hard Iron Saturation of magnetic sensor Avoid placement near permanent magnetic fields
Soft Iron Angular error of magnetic field Avoid placement near ferromagnetic materials
Noise
Increased noise or jitter within magnetic
field
Avoid placement near current fluctuation
Compass
Coupling of device pitch and compass
heading
Ensure compass heading is computed with three-axis data
Package Stress Increased sensor offsets
Place part in a location of minimal PCB stress, do not solder
Exposed Pad
Thermal Stress Temperature variation of data Avoid a thermal gradient across the part
Impact Survivability Shock Failure, damage to MEMS device
Ensure surrounding surfaces will not impact MEMS device in event
of shock