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AN-MPU-x000A-01

InvenSense reserves the right to change the detail

specifications as may be required to permit improvements

in the design of its products.

InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

www.invensense.com

Document Number: AN-MPU-x000A-01
Revision: 1.1
Date: 06/12/2015

PCB Design Guidelines for InvenSense

MotionTracking™ Devices

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Содержание MPU-9250

Страница 1: ... may be required to permit improvements in the design of its products InvenSense Inc 1745 Technology Drive San Jose CA 95110 U S A 1 408 988 7339 www invensense com Document Number AN MPU x000A 01 Revision 1 1 Date 06 12 2015 PCB Design Guidelines for InvenSense MotionTracking Devices ...

Страница 2: ...lyzing Sensor Data Issues Due to Sensor Placement 11 5 1 Overview 11 5 2 Analyzing Sensor Data 11 6 Quick Reference 12 Revision History 13 TABLE OF TABLES Figure 1 Change in Magnetic Field Caused by Hard Iron Distortion 4 Figure 2 Change in Magnetic Field Caused by Soft Iron Distortion 4 Figure 3 Typical Handset Components Causing Hard Soft Iron Effects and Magnetometer Location 5 Figure 4 Example...

Страница 3: ...ific requirements in order to ensure the highest performance in a finished product For a layout assessment of your design including placement and estimated magnetic disturbances please contact InvenSense 2 GENERAL DESCRIPTION OF INVENSENSE MOTIONTRACKING DEVICES InvenSense MotionTracking Devices such as the MPU 6050 MPU 6500 MPU 9150 or MPU 9250 consist of combinations of 3 axis MEMS gyroscopes 3 ...

Страница 4: ...ety of common components including heat sinks fasteners hinges connectors batteries spring steel dome switches chip capacitors and some integrated circuits Fig 2 shows the change in sensed magnetic field caused by Soft Iron distortion which has the effect of transforming the typically spherical sensed field into an ellipsoid Figure 2 Change in Magnetic Field Caused by Soft Iron Distortion Ferritic...

Страница 5: ...will invalidate the current calibration and require an immediate recalibration for best performance 3 2 CALIBRATION OF HARD AND SOFT IRON DISTORTION Hard iron distortion can be corrected through a sensor bias estimation The bias introduced by hard iron distortion may be calculated by measuring the magnetometer at known orientations and estimating a fixed offset or applying a spherical model to mag...

Страница 6: ...device on a flat plane A much more accurate calculation includes rotating the sensed magnetic field to a horizontal plane prior to computing the heading angle For static measurements when the device is stationary an accelerometer reading is sufficient to estimate roll and pitch while during dynamic movements the orientation output of Motion Fusion is recommended Quaternion rotation may be applied ...

Страница 7: ...m represents maximum conditions required for component reliability testing Typical lead free reflow solder processing is conducted between 235 C and 260 C It is recommended not to hand solder the MPU as the uneven application of heat during soldering may introduce an undesired bias offset in the part Do not place any component pads or vias within 2mm of the package land area in order to ensure eve...

Страница 8: ...lude processors power management circuitry or high current devices The temperature gradient across the MPU should be minimized for best results 4 3 EXPOSED PAD REQUIREMENTS PCB land patterns are defined within the Product Specification document and should be followed closely The center Exposed Pad EP for MPU devices is a No Connect NC pad To avoid package stress do not solder the EP to the PCB The...

Страница 9: ...PU should be mounted in a rigid location which will have minimal external vibration Moving parts which cause vibration and are not intended to be measured such as speakers vibration haptic motors buttons etc figure 9 should be mechanically isolated from the MPU Figure 9 Speaker and Tactile Vibrations Can be Interpreted as Noise by the MPU Active signals may harmonically couple with the gyro MEMS d...

Страница 10: ... resonance frequency The recommendation is to place any acceleration or vibration sources as far away as possible from MEMS devices However in the situation that the customer has limited board space and placement options are limited the recommended distance is 5mm away from the MEMS device If placement is uncertain customer should consult with local FAE to provide a more detailed analysis Figure 1...

Страница 11: ...ools provided by InvenSense to first verify if the sensor is responding correctly and the sensor data is within spec Analyzing run time sensor data will help in detecting problems with sensor performance 5 2 1 2 Third Party Sensor Tools Third party tools such as Microsoft s Sensor Diagnostic Tool or Traceview can be also used to collect run time sensor data to detect problems with sensor performan...

Страница 12: ...ent magnetic fields Soft Iron Angular error of magnetic field Avoid placement near ferromagnetic materials Noise Increased noise or jitter within magnetic field Avoid placement near current fluctuation Compass Coupling of device pitch and compass heading Ensure compass heading is computed with three axis data Package Stress Increased sensor offsets Place part in a location of minimal PCB stress do...

Страница 13: ...0A 01 Document Number AN MPU x000A 01 Page 13 of 14 Revision 1 1 Date 06 12 2015 REVISION HISTORY REVISION DATE REVISION DESCRIPTION Dec 18 2012 1 0 Initial Release June 12 2015 1 1 Updates to section 4 1 and 4 5 ...

Страница 14: ...or other intellectual property rights Certain intellectual property owned by InvenSense and described in this document is patent protected No license is granted by implication or otherwise under any patent or patent rights of InvenSense This publication supersedes and replaces all information previously supplied Trademarks that are registered trademarks are the property of their respective compani...

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