Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor, Руководство по конструкции

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Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 15
Package Mechanical Specifications
2.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Do not contact the Test Pad Area with
conductive material. Decoupling capacitors are typically mounted to either the topside
or land-side of the package substrate. See
Figure 2-2 and Figure 2-3 for keep-out
zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
2.1.3 Package Loading Specifications
Table 2-1 provides load specifications for the processor package. These maximum
limits should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Exceeding these limits during test may result in component
failure. The processor substrate should not be used as a mechanical reference or load-
bearing surface for thermal solutions.
.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism
(ILM).
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package constrained by the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
2.1.4 Package Handling Guidelines
Table 2-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
2.1.5 Package Insertion Specifications
The processor can be inserted into and removed from a LGA1366 socket 15 times. The
socket should meet the LGA1366 requirements detailed in
Section 5 .
Table 2-1. Processor Loading Specifications
Parameter Maximum Notes
Static Compressive Load 890 N [200 lbf] 1, 2, 3
Dynamic Compressive Load 1779 N [400 lbf] [max static
compr dynamic load]
1, 3, 4
Table 2-2. Package Handling Guidelines
Parameter Maximum Recommended
Shear 70 lbs
Tensile 25 lbs
Torque 35 in.lbs