Intel SC450NX - Server Platform - 0 MB RAM, Руководство по эксплуатации продукта

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Peripherals
3.5-inch Diskette Drive
The 3.5-inch diskette drive in the 3.5-inch peripheral bay supports 720 KB, and 1.44 MB media.
The drive is externally accessible from the front of the system.
3.5-inch Hard Drive Bays
The chassis contains one bay for two 3.5-inch-wide (1" high or 1-5/8" high) LVDS SCSI hard
drives with internal cabling. An optional hot-swap-capable backplane can accommodate six
3.5-inch-wide (1" high) or three 3.5-inch (1-7/8" high) hard drives, which are accessed externally
from the front of the system. To upgrade to a backplane, or to upgrade your existing backplane,
you must buy a kit.
As part of the hot-swap implementation, a drive carrier is required. The drives are mounted in the
carrier with four fasteners and the carrier snaps into the chassis. Drives whose power exceeds 15
watts require heatsinks and system fans for extra cooling. These parts are available in an optional
kit.
•
For information on how and when to install heatsinks, see “Installing Heatsinks on High-
Power Drives” on page 82.
•
For information on how and when to install extra fans, see “Installing Fans for High-Power
Drives” on page 106.
A single metal EMI shield and plastic door cover the drive bays. A hot-docking bay is provided
for drives that are 3.5 inches wide and 1 inch high. Drives can consume up to 22 watts of power
and must be specified to run at a maximum ambient temperature of 55
°
C.
The system was designed to allow the user to install a Redundant Array of Independent Disks
(RAID). A software implementation with onboard SCSI or an add-in board can be used to set up
RAID applications.
5.25-inch Removable Media Device Bays
The chassis has three 5.25-inch half-height bays that are accessible from the front of the system.
These bays are intended to provide space for tape backup or other removable devices.
You can convert the 5.25-inch bays to a single full-height bay. We recommend that you do not use
these bays for hard disk drives, because they generate EMI (increasing ESD susceptibility), and
because of inadequate cooling.