Intel NetStructure ZT 5085, Руководство пользователя

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70
Technical Product Specification
Specifications
A.4 MTBF Prediction
Table 16 lists component, temperature, MTBF, and redundancy information. See table notes at the
bottom of this page.
A.5 Connectors
As shown in Figure 32 , the ZT 5085's midplane includes several connectors to interface with
application-specific devices. A brief description of each connector is given in Table 32, “P1
Connector CMM Pin Assignments” on page 89 . A detailed description and pinout for each
connector is given in the following sections.
Table 16. MTBF Prediction on ZT 5085 DC
System
Component
Sub-
Module
Ambient
Temp.
Base
Failure
Rate
Base
MTBF
Qty
Total Sub-System
Failure Rate
Total
Sub-System
MTBF
††Intended
Redundancy
MidPlane 40 3891 257,003 1 3891 257,003 1 + 0
MidPlane
w/o Conn
40 1311 762,777 1 1311 762,777 1 + 0
ZT 7102 40 2086 479,386 2 4172 239,693 1 + 1
Filter
Module
40 178 5,617,978 1 178 5,617,978 1 + 0
Power
MidPlane
40 1495 668,896 2 2990 334,448 2 + 0
Fan Tray† 40 6193 161,473 3 18579 53,824 8 + 1 (Fans)
Power
Supply
25 2183 458,085 8 17464 57,261 (2 + 2) x 2
System
Total
44694 22,374
NOTES:Environmental Assumptions:
1. Failure rates are based on a 25 C inlet chassis temperature with a 15 C increase in internal chassis
temperature
2. Applied electrical component stress levels are 50% (Voltage, Current, and/or Power)
3. Power Supply is at a 50% load.
4. Ground, Fixed, Controlled environment with an environmental adjustment factor equal to 1.0
NOTES:General Assumptions / Notes:
1. Component failure rates are constant
2. Midplane provided with and without to cPCI* Board interconnects
3. Non-electrical components (screws, mechanical latches, labels, covers, chassis) not included within
calculations
4. Printed Circuit Board and wiring cables considered to have a 0 FIT rate
5. Power Supply information was generated using MIL-217 Standard
NOTES:General Notes:
1. Method I, Case I = Based on “Parts Count”. Equipment failure is estimated by totaling device failures rates
and quantities used.
2. Quality Level II = Devices purchased to specifications, qualified devices, vendor lot-to-lot controls for AQLs
and DPMs.
3. Where available, direct component supplier predictions or actual FIT rates have been utilized.
4. †Data used for Delta fans is preliminary
5. ††Indicates the usage redundancy as modeled during development. Actual redundancy of the system is
dependant on customer integration and loading.