Introduction and Features Summary
Intel
®
Core
TM
i7-620LE/UE, i7-610E, i5-520E and Intel
®
Celeron
®
Processor P4500, P4505 Series
Datasheet Addendum
April 2010
8
Document Number: 323178-002
1
Introduction and Features
Summary
1.1
Introduction
This Datasheet Addendum is a supplement to the
Intel® Core
TM
i7-600, i5-500 and i3-
300 Mobile Processor Series Datasheet
. It contains the additional DC and AC electrical
specifications, signal integrity, differential signaling specifications, pinout and signal
definitions, interface functional descriptions, additional feature information and
configuration registers pertinent to the implementation and operation of the Intel
®
Core
TM
i7-620LE/UE, i7-610E, i5-520E and Intel
®
Celeron
®
Processor P4500, P4505
Series on its respective platform.
Intel
®
Core
TM
i7-620LE/UE, i7-610E, i5-520E and Intel
®
Celeron
®
Processor P4500,
P4505 Series is the next generation of 64-bit, multi-core mobile processor built on a
32- nanometer process technology. Throughout this document, Intel
®
Core
TM
i7-
620LE/UE, i7-610E, i5-520E and Intel
®
Celeron
®
Processor P4500, P4505 Series may
be referred to as simply the processor. The processor is designed for a two-chip
platform as opposed to the traditional three-chip platforms (processor, GMCH, and
ICH). The two-chip platform consists of a processor and the Platform Controller Hub
(PCH) and enables higher performance, lower cost, easier validation, and improved x-y
footprint. The PCH may also be referred to as Mobile Intel® 5 Series Chipset (formerly
Ibex Peak-M). Intel
®
Core
TM
i7-620LE/UE, i7-610E, i5-520E and Intel
®
Celeron
®
Processor P4500, P4505 Series is designed for the Intel
®
Core
TM
i7 processor based
low-power platform and is offered in a BGA1288 package.
Included in this family of processors is an integrated graphics and memory controller
die on the same package as the processor core die. This two-chip solution of a
processor core die with an integrated graphics and memory controller die is known as a
multi-chip package (MCP) processor.
Note:
Integrated graphics and memory controller die is built on 45-nanometer process
technology.