Intel Celeron D, Руководство по тепловому проектированию

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Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide 51
Order #
303730
Case Temperature Reference Methodology
D.15 Thermocouple Attach Procedure
D.15.1 Thermocouple Conditioning and Preparation
1. Use a calibrated thermocouple as specified in Section D.12 and Section D.13 .
2. Measure the thermocouple resistance by holding both wires on one probe and the tip of the
thermocouple to the other probe of the DMM. The measurement should be about~75 ohms for
40-gauge type T thermocouple.
3. Straighten the wire for about 38 mm [1½ inch] from the bead to place it inside the channel.
4. Bend the tip of the thermocouple at approximately 45 degree angle by about 0.8 mm [.030
inch] from the tip ( Figure 22 ).
D.15.2 Thermocouple Attachment to the IHS
5. Clean groove with IPA and a lint free cloth removing all residues prior to thermocouple
attachment.
6. Place the thermocouple wire inside the groove; letting the exposed wire and bead extend about
3.2 mm [.125 inch] past the end of groove. Secure it with Kapton* tape ( Figure 23 ).
Figure 22. Bending the Tip of the Thermocouple
Figure 23. Securing Thermocouple Wires with Kapton* Tape Prior to Attach