LGA1156 Socket
22
Thermal/Mechanical Specifications and Design Guidelines
3.2
LGA1156 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The signals at NCTF
locations are typically redundant ground or non-critical reserved, so the loss of the
solder joint continuity at end of life conditions will not affect the overall product
functionality.
identifies the NCTF solder joints.
Figure 3-4. LGA1156 Socket NCTF Solder Joints
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W AA AC AE AG AJ AL AN AR AU AW
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V Y AB AD AF AH AK AM AP AT AV AY
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Y AB AD AF AH AK AM AP AT AV AY
20 mil corner NCTF
20 mil corner CTF
14 x 18 mil oval pads
16.9 mil circular pads
Содержание BX80605X3440 - Quad Core Xeon X3440
Страница 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Страница 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Страница 78: ...Component Suppliers 78...
Страница 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Страница 81: ...81 Mechanical Drawings Figure B 2 Socket Heatsink ILM Keepout Zone Secondary Side for 1U Bottom...
Страница 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Страница 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Страница 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Страница 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Страница 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Страница 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Страница 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
