Intel BLKDP55WG - P55 LG1156 MAX-16 GB DDR3 ATX Motherboard, Технические характеристики продукции

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Contents
vii
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 77
5.1.1 Safety Standards.................................................................. 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements................................................... 79
5.1.4 EMC Regulations .................................................................. 83
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration ........................................... 17
4. Back Panel Audio Connector Options .................................................. 22
5. LAN Connector LED Locations............................................................ 24
6. Thermal Sensors and Fan Headers ..................................................... 26
7. Locations of Indicator LEDs ............................................................... 34
8. Location of the Onboard Power Button................................................ 35
9. Detailed System Memory Address Map ............................................... 38
10. Back Panel Connectors ..................................................................... 40
11. Component-side Connectors and Headers ........................................... 41
12. Connection Diagram for Front Panel Header ........................................ 48
13. Connection Diagram for Front Panel USB Headers ................................ 50
14. Connection Diagram for IEEE 1394a Header ........................................ 50
15. Location of the Jumper Block............................................................. 51
16. Board Dimensions ........................................................................... 53
17. Localized High Temperature Zones..................................................... 57
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. LAN Connector LED States ................................................................ 24
5. Effects of Pressing the Power Switch .................................................. 27
6. Power States and Targeted System Power........................................... 28
7. Wake-up Devices and Events ............................................................ 29
8. System Memory Map ....................................................................... 39
9. Component-side Connectors and Headers Shown in Figure 11................ 42
10. IEEE 1394a Header.......................................................................... 43
11. Front Panel Audio Header ................................................................. 43
12. SATA Connectors............................................................................. 43
13. S/PDIF Header ................................................................................ 43
14. Chassis Intrusion Header .................................................................. 44
15. Processor, Front and Rear Chassis (4-Pin) Fan Headers ........................ 44
16. Processor Core Power Connector........................................................ 46