ATX Thermal/Mechanical Design Information
60
Thermal and Mechanical Design Guidelines
6.7
Reference Attach Mechanism
6.7.1
Structural Design Strategy
Structural design strategy for the reference design is to minimize upward board
deflection during shock to help protect the LGA775 socket.
The reference design uses a high clip stiffness that resists local board curvature under
the heatsink, and minimizes, in particular, upward board deflection (Figure 6-5). In
addition, a moderate preload provides initial downward deflection.
Figure 6-5. Upward Board Deflection during Shock
The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined target
for reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. The
nominal preload provided by the reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb].
Note:
Intel reserves the right to make changes and modifications to the design as necessary
to the reference design, in particular the clip and fastener.
Less curvature in
region under stiff clip
Shock Load
Содержание AT80569PJ080N - Core 2 Quad 3 GHz Processor
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Страница 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines...
Страница 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines...
Страница 106: ...Balanced Technology Extended BTX System Thermal Considerations 106 Thermal and Mechanical Design Guidelines...
Страница 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines...
Страница 120: ...Mechanical Drawings 120 Thermal and Mechanical Design Guidelines Figure 7 50 Reference Fastener Sheet 1...
Страница 121: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 121 Figure 7 51 Reference Fastener Sheet 2...
Страница 122: ...Mechanical Drawings 122 Thermal and Mechanical Design Guidelines Figure 7 52 Reference Fastener Sheet 3...
Страница 123: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 123 Figure 7 53 Reference Fastener Sheet 4...