Intel 6700PXH 64-BIT PCI HUB - MECHANICAL DESIGN Скачать руководство пользователя страница 22

Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

 

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Intel

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 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

  

 

Figure 6-7. Torsional Clip Heatsink Extrusion Profile 

 

6.5.6 Clip 

Retention 

Anchors 

For Intel

®

 6700PXH 64-bit PCI Hub-based platforms that have very limited board space, a clip 

retention anchor has been developed to minimize the impact of clip retention on the board. It is 
based on a standard three-pin jumper and is soldered to the board like any common through-hole 
header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability 
over time. See Appendix A for the part number and supplier information. 

6.6 Reliability 

Guidelines 

Each motherboard, heatsink and attach combination may vary the mechanical loading of the 
component. Based on the end user environment, the user should define the appropriate reliability 
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some 
general recommendations are shown in Table 6-2Table 6-2Table 6-2. 

Table 6-2. Reliability Guidelines  

Test 

(1)

 Requirement Pass/Fail 

Criteria 

(2)

 

Mechanical Shock 

50 g, board level, 11 msec, 3 shocks/axis. 

Visual Check and Electrical 
Functional Test 

Random Vibration 

7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz. 

Visual Check and Electrical 
Functional Test 

Temperature Life 

85°C, 2000 hours total, checkpoints at 168, 500, 
1000, and 2000 hours. 

Visual Check 

Thermal Cycling 

–5°C to +70°C, 500 cycles. 

Visual Check 

Humidity 

85% relative humidity, 55°C, 1000 hours. 

Visual Check 

NOTES: 

 

1.  It is recommended that the above tests be performed on a sample size of at least twelve assemblies from 

three lots of material. 

2.  Additional pass/fail criteria may be added at the discretion of the user.   

Содержание 6700PXH 64-BIT PCI HUB - MECHANICAL DESIGN

Страница 1: ...R Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines August 2004 Document Number 302817 003...

Страница 2: ...erves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel 6700PXH 64 bit PCI Hub chipset component...

Страница 3: ...Zero Degree Angle Attach Methodology 15 6 Reference Thermal Solution 17 6 1 Operating Environment 17 6 2 Heatsink Performance 17 6 3 Mechanical Design Envelope 18 6 4 Board Level Components Keepout Di...

Страница 4: ...2 Torsional Clip Heatsink Volumetric Envelope for the Intel 6700PXH 64 bit PCI Hub Chipset Component 18 6 3 Torsional Clip Heatsink Board Component Keepout 19 6 4 Retention Mechanism Component Keepou...

Страница 5: ...sign Guidelines 5 Revision History Revision Number Description Date 001 Initial release Jul 2004 002 Added reference thermal solution rails to PXH package footprint drawing in Section 6 5 Aug 2004 003...

Страница 6: ...Introduction R 6 Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines...

Страница 7: ...rove the inherent system cooling characteristics is through careful chassis design and placement of fans vents and ducts When additional cooling is required component thermal solutions may be implemen...

Страница 8: ...following documents Intel 82801EB I O Controller Hub 5 ICH5 and Intel 82801ER I O Controller Hub 5 R ICH5R Datasheet Intel 82801EB I O Controller Hub 5 ICH5 and Intel 82801ER I O Controller Hub 5 R IC...

Страница 9: ...mm 17 00 mm 0 200 in Figure 2 2 Intel 6700PXH 64 bit PCI Hub Package Dimensions Side View 0 20 C Die Substrate 0 435 0 025 mm See Note 3 Seating Plane 2 010 0 099 mm See Note 1 Decoup Cap 0 7 mm Max 2...

Страница 10: ...bare die which is capable of sustaining a maximum static normal load of 15 lbf The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die These...

Страница 11: ...Intel recommends that system designers plan for a heatsink when using the PXH component 3 2 Die Case Temperature Specifications To ensure proper operation and reliability of the PXH component the die...

Страница 12: ...Thermal SpecificationsThermal Simulation R 12 Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines...

Страница 13: ...esigners in simulating analyzing and optimizing their thermal solutions in an integrated system level environment The models are for use with the commercially available Computational Fluid Dynamics CF...

Страница 14: ...Thermal SimulationThermal Simulation R 14 Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines...

Страница 15: ...onduction through thermocouple leads or contact between the thermocouple cement and the heatsink base if a heatsink is used For maximum measurement accuracy only the 0 thermocouple attach approach is...

Страница 16: ...H 64 bit PCI Hub Thermal Mechanical Design Guidelines Figure 5 1 Zero Degree Angle Attach Heatsink Modifications NOTE Not to scale Figure 5 2 Zero Degree Angle Attach Methodology Top View Cement Therm...

Страница 17: ...nimum recommended airflow velocity through the cross section of the heatsink fins is 200 linear feet per minute lfm The approaching airflow temperature is assumed to be equal to the local ambient temp...

Страница 18: ...Heatsink Base Die TIM FCBGA Solder Balls Heatsink Fin Heatsink Fin 31 00mm 31 00mm 14 71mm 1 86mm 3 01mm 3 00mm 6 4 Board Level Components Keepout Dimensions The locations of hole pattern and keepout...

Страница 19: ...756 2x 0 943 PXH 2x 0 878 1 886 Max component Height 0 50 Component keepout area NOTE All dimensions are in inches Figure 6 4 Retention Mechanism Component Keepout Zones 0 500 0 345 0 120 0 750 0 170...

Страница 20: ...re 6 6 Heatsink Rails to PXH Package Footprint 6 5 2 Extruded Heatsink Profiles The reference torsional clip heatsink uses an extruded heatsink for cooling the PXH component Figure 6 7Figure 6 7Figure...

Страница 21: ...ure increases on the TIM the thermal resistance of the TIM decreases This phenomenon is due to the decrease of the bond line thickness BLT BLT is the final settled thickness of the thermal interface m...

Страница 22: ...echanical loading of the component Based on the end user environment the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high...

Страница 23: ...tsink 31 0 x 31 0 x 12 2 mm C76434 001 CCI ACK Harry Lin USA 714 739 5797 hlinack aol com Monica Chih Taiwan 866 2 29952666 x131 monica_chih ccic com tw Thermal Interface Chomerics T 710 A69230 001 Ch...

Страница 24: ...Thermal Solution Component Suppliers R 24 Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines...

Страница 25: ...B 1 lists the mechanical drawings included in this appendix Table B 1 Mechanical Drawing List Drawing Description Figure Number Torsional Clip Heatsink Assembly Drawing Figure B 1Figure B 1Figure B 1...

Страница 26: ...Mechanical Drawings R 26 Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines Figure B 1 Torsional Clip Heatsink Assembly Drawing...

Страница 27: ...R Mechanical Drawings Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines 27 Figure B 2 Torsional Clip Heatsink Drawing...

Страница 28: ...Mechanical Drawings R 28 Intel 6700PXH 64 bit PCI Hub Thermal Mechanical Design Guidelines Figure B 3 Torsional Clip Drawing...

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