R
Intel
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
11
3 Thermal
Specifications
3.1
Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the PXH component to consume
maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more
realistic power level for thermal design purposes, Intel characterizes power consumption based on
known platform benchmark applications. The resulting power consumption is referred to as the
Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be
designed to. TDP is not the maximum power that the chipset can dissipate.
For TDP specifications, see Table 3-1 for the PXH component. Flip chip ball grid array (FC-BGA)
packages have poor heat transfer capability into the board and have minimal thermal capability
without
a
thermal solution. Intel recommends that system designers plan for a heatsink when using
the PXH component.
3.2
Die Case Temperature Specifications
To ensure proper operation and reliability of the PXH component, the die temperatures must be at or
between the maximum/minimum operating temperature ranges as specified in Table 3-1Table 3-
1Table 3-1. System and/or component level thermal solutions are required to maintain these
temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package die
temperatures.
Table 3-1. Intel
®
6700PXH 64-bit PCI Hub Thermal Specifications
Parameter Value
Notes
T
case
_max
105°C
T
case_min
5°C
TDP
Segment A @ 66 MHz and Segment B @ 66 MHz
9.0
watts
TDP
Segment A @ 100 MHz and Segment B @ 100 MHz
8.9
watts
TDP
Segment A @ 133 MHz and Segment B @ 133 MHz
8.6
watts
TDP
Segment A @ 66 MHz and Segment B @ 100 MHz
8.9
watts
TDP
Segment A @ 66 MHz and Segment B @ 133 MHz
8.8
watts
TDP
Segment A @ 100 MHz and Segment B @ 133 MHz
8.7
watts
Note:
These specifications are based on silicon characterization, however, they may be updated as further
data becomes available.
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