Intel 500 - DATASHEET REV 003, Техническое описание

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Datasheet 3
Contents
1 Introduction ..............................................................................................................7
1.1
Terminology .......................................................................................................8
1.2 References .........................................................................................................9
2 Low Power Features ................................................................................................ 11
2.1
Clock Control and Low Power States .................................................................... 11
2.1.1
Core Low-Power States ........................................................................... 12
2.1.1.1
C0 State .................................................................................. 12
2.1.1.2 C1/AutoHALT Powerdown State .................................................. 12
2.1.1.3 C1/MWAIT Powerdown State ...................................................... 13
2.1.1.4 Core C2 State........................................................................... 13
2.1.1.5 Core C3 State........................................................................... 13
2.1.2 Package Low-Power States ...................................................................... 13
2.1.2.1
Normal State............................................................................ 13
2.1.2.2 Stop-Grant State ...................................................................... 13
2.1.2.3 Stop Grant Snoop State ............................................................. 14
2.1.2.4 Sleep State .............................................................................. 14
2.1.2.5 Deep Sleep State ...................................................................... 15
2.2 Low-Power FSB Features .................................................................................... 15
2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 15
3 Electrical Specifications ........................................................................................... 17
3.1
Power and Ground Pins ...................................................................................... 17
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 17
3.3 Voltage Identification ......................................................................................... 17
3.4 Catastrophic Thermal Protection .......................................................................... 21
3.5 Reserved and Unused Pins.................................................................................. 21
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................ 22
3.7 FSB Signal Groups............................................................................................. 22
3.8 CMOS Signals ................................................................................................... 23
3.9 Maximum Ratings.............................................................................................. 23
3.10 Processor DC Specifications ................................................................................ 24
4 Package Mechanical Specifications and Pin Information .......................................... 29
4.1
Package Mechanical Specifications ....................................................................... 29
4.2 Processor Pinout and Pin List .............................................................................. 34
4.3 Alphabetical Signals Reference ........................................................................... 53
5 Thermal Specifications ............................................................................................ 61
5.1
Thermal Diode .................................................................................................. 62
5.1.1
Thermal Diode Offset .............................................................................. 62
5.2 Intel® Thermal Monitor...................................................................................... 64
5.3 Digital Thermal Sensor....................................................................................... 66
5.4 Out of Specification Detection ............................................................................. 66
5.5 PROCHOT# Signal Pin ........................................................................................ 67