Sensor Based Thermal Specification Design Guidance
66
Thermal/Mechanical Specifications and Design Guidelines
8.2.2
Specification When DTS value is Greater than T
CONTROL
The product specification provides a table of
CA
values at DTS = T
CONTROL
and
DTS = -1 as a function of T
AMBIENT
(inlet to heatsink). Between these two defined
points, a linear interpolation can be done for any DTS value reported by the processor.
A copy of the specification is provided as a reference in
The fan speed control algorithm has enough information using only the DTS value and
T
AMBIENT
to command the thermal solution to provide just enough cooling to keep the
part on the thermal profile.
has been plotted in
to show the
required
CA
at 25, 30, 35 and 40°C T
AMBIENT
. The lower the ambient, the higher the
required
CA
which means lower fan speeds and reduced acoustics from the processor
thermal solution.
In the prior thermal specifications this region, DTS values greater than T
CONTROL
, was
defined by the processor thermal profile. This required the user to estimate the
processor power and case temperature. Neither of these two data points are accessible
in real time for the fan speed control system. As a result, the designer had to assume
the worst case T
AMBIENT
and drive the fans to accommodate that boundary condition.
8.3
Thermal Solution Design Process
Thermal solution design guidance for this specification is the same as with previous
products. The initial design needs to take into account the target market and overall
product requirements for the system. This can be broken down into several steps:
• Boundary condition definition
• Thermal design / modelling
• Thermal testing.
Figure 8-3. Thermal solution Performance
0.300
0.350
0.400
0.450
0.500
0.550
0.600
0.650
0.700
DTS = Tcontrol
DTS = -1
T
T
V
T
h
e
ta_ca [
C
/W
]
Ta = 40 °C
Ta = 35 °C
Ta = 30 °C
Ta = 25 °C
TTV
Ψ
_ca @
TTV
Ψ
_ca @
Содержание 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Страница 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Страница 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Страница 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Страница 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Страница 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Страница 118: ...Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guidelines Figure B 13 ILM Shoulder Screw...
Страница 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Страница 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Страница 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...
