Thermal/Mechanical Specifications and Design Guidelines
77
Sensor Based Thermal Specification Design Guidance
In the system under test and Power/Thermal Utility Software set to dissipate the TDP
workload confirm the following item:
• Verify if there is TCC activity by instrumenting the PROCHOT# signal from the
processor. TCC activation in functional application testing is unlikely with a
compliant thermal solution. Some very high power applications might activate TCC
for short intervals this is normal.
• Verify fan speed response is within expectations - actual RPM (
CA
) is consistent
with DTS temperature and T
AMBIENT
.
• Verify RPM versus PWM command (or voltage) output from the FSC device is within
expectations.
• Perform sensitivity analysis to asses impact on processor thermal solution
performance and acoustics for the following:
— Other fans in the system.
— Other thermal loads in the system.
In the same system under test, run real applications that are representative of the
expected end user usage model and verify the following:
• Verify fan speed response versus expectations as done using Power/Thermal Utility
SW.
• Validate system boundary condition assumptions: Trise, venting locations, other
thermal loads and adjust models / design as required.
8.6
Thermal Solution Characterization
is early engineering data on the RCBF7-1156 (DHA-A) thermal solution as a
reference for the development of thermal solutions and the fan speed control
algorithm.
Table 8-3.
Thermal Solution Performance above T
CONTROL
(Sheet 1 of 2)
T
AMBIENT
1
CA
at
DTS = T
CONTROL
2
RPM for
CA
at
DTS = T
CONTROL
CA
at
DTS = -1
3
RPM for
CA
at
DTS = -1
45.1
0.290
N/A
0.290
N/A
44.0
0.310
N/A
0.301
N/A
43.0
0.328
N/A
0.312
N/A
42.0
0.346
2950
0.322
N/A
41.0
0.364
2600
0.333
N/A
40.0
0.383
2300
0.343
3150
39.0
0.401
2100
0.354
2750
38.0
0.419
1900
0.364
2600
37.0
0.437
1750
0.375
2400
36.0
0.455
1650
0.385
2250
35.0
0.473
1500
0.396
2150
34.0
0.491
1400
0.406
2050
33.0
0.510
1350
0.417
1900
32.0
0.528
1200
0.427
1850
31.0
0.546
1150
0.438
1750
30.0
0.564
1050
0.448
1650
29.0
0.582
1000
0.459
1600
Содержание 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES 01-2011
Страница 12: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Страница 36: ...Independent Loading Mechanism ILM 36 Thermal Mechanical Specifications and Design Guidelines...
Страница 62: ...PECI Interface 62 Thermal Mechanical Specifications and Design Guidelines...
Страница 88: ...ATX Reference Thermal Solution 88 Thermal Mechanical Specifications and Design Guidelines...
Страница 102: ...Boxed Processor Specifications 102 Thermal Mechanical Specifications and Design Guidelines...
Страница 118: ...Mechanical Drawings 118 Thermal Mechanical Specifications and Design Guidelines Figure B 13 ILM Shoulder Screw...
Страница 120: ...Mechanical Drawings 120 Thermal Mechanical Specifications and Design Guidelines...
Страница 126: ...Socket Mechanical Drawings 126 Thermal Mechanical Specifications and Design Guidelines...
Страница 130: ...Package Mechanical Drawings 130 Thermal Mechanical Specifications and Design Guidelines...