Application Note
12
<Revision 2.4>
<<2019-06-17>>
Assembly Instructions for the Easy-PressFIT Modules
5
Quality of PressFIT contacts
PressFIT is an alternative solution for connecting control and load current contacts on IGBT modules with a
PCB.
The requirements for greater durability, the trend towards higher temperatures and absence of lead, and, of
course, very simple handling, are continuously growing.
As an advanced technology on the market, the PressFIT makes it possible to improve reliability up to a factor of
100 compared to manually soldered contacts and other contact types. The results of the reliability analyses in
the Siemens norm SN 29500-5 demonstrate the factor.
The assembly process is simple, and consequently saves time and money. The process is reliable, and system
reparability is ensured.
An extract from the Siemens norm SN 29500-5 / Edition 2004-06 Part 5 shown in Table 3 illustrates the failure
rates of different contact technologies.
Table 3
Failure rates for various contact technologies Siemens norm SN 29500-5 /
edition 2004-06 Part 5
Process
Conductor diameter in
mm²
Failure rate
λ
ref in FIT1)
Notes:
Standards/guidelines
Solder manual
Automatic
_
0.5
0.03
IPC 6102), class 2
Wire bonding for hybrid
circuits Al
Au
0.1
0.1
28
μ
m / wedge bond
25
μ
m / ball bond
Winding
0.05 to 0.5
0.002
DIN EN 60352 – 1 /
IEC 60352 – 1 CORR1
Crimping manual
Automatic
0.05 to 300
0.25
DIN EN 60352 – 2 /
IEC 60352 – 2 A 1+2
Clips
0.1 to 0.5
0.02
DIN 41611 – 4
PressFIT
0.3 to 2
0.005
IEC 60352 – 5
Insulation piercing
connectors
0.05 to 1
0.25
IEC 60352 – 3 / IEC 60352
– 4
Screws
0.5 to 16
0.5
DIN EN 60999 – 1
Terminals (spring force) 0.5 to 16
0.5
DIN EN 60999 – 1
1) 1 FIT = 1 x 10-9 1/h; (one failure per 109 component hours)
2) Acceptance conditions for PCBs
The PressFIT contact has been qualified in accordance with the usual standards for IGBT modules at Infineon.
Figure 12 shows a small extract of the various tests. The extract shows that the conditions in the individual tests
are to be regarded as considerably stricter than stated in the standards. For example, in a corrosive gas test, the
temperatures in scope of individual test is 15 K higher than the condition in the standard. And the H2S
