NEUROPIXELS 1.0 USER MANUAL V1.0.5
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Figure 42: Placing the solder tip in the corner between wire and pad.
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Feed a small amount of solder to the corner between the solder tip and wire. The solder melts
on the pad and the GND/REF wire. Solder wire can be purchased in different diameters. For this
application it is advisable to use a smaller diameter (< 1 mm), also depending on the diameter
of the GND/REF wire.
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The soldering time and temperature should be minimized to <4 s and max. 350°C, respectively.
Figure 43: Wire soldered to the solder pad.
An alternative method does not make use of the hole in the solder pad:
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Apply some solder to the solder pad and GND/REF wire separately. (Figure 44)
