16. Packaging
266
Tsi384 User Manual
May 5, 2014
Integrated Device Technology
www.idt.com
16.2
Thermal Characteristics
Heat generated by the packaged silicon must be removed from the package to ensure the silicon is
maintained within its functional and maximum design temperature limits. If heat buildup becomes
excessive, the silicon temperature may exceed the temperature limits. A consequence of this is that the
silicon may fail to meet the performance specifications and the reliability objectives may be affected.
Failure mechanisms and failure rate of a device has an exponential dependence on the silicon operating
temperatures. Therefore, the control of the package, and by extension the Junction temperature, is
essential to ensure product reliability. The Tsi384 is specified safe for operation when the Junction
temperature is within the recommended limits as shown in
shows the simulated thermal characteristic (
JB
and
JC
) of the Tsi384 package.
Table 57: Thermal Characteristics
shows the simulated Junction to Ambient (
JA
) characteristics of the Tsi384. The thermal
resistance
JA
characteristics of a package depends of multiple variables other than just the package. In
a typical application, designers must take into account various system-level and environmental
characteristics, such as:
•
Package mounting (vertical/horizontal)
•
System airflow conditions (laminar/turbulent)
•
Heat sink design and thermal characteristics
•
Heat sink attachment method
•
PWB size, layer count, and conductor thickness
•
Influence of the heat dissipating components assembled on the PWB (neighboring effects)
The results in
are based on a JEDEC Thermal Test Board configuration (JESD51-9), and does
not factor in the system-level characteristics described above. As such, these values are for reference
only.
Table 58: Junction to Ambient Characteristics
Interface
Results
JB
15.2
°
C/W
Jc
9.6
°
C/W
Device
JA
at Specified Airflow (No heat sink)
0 m/s
1 m/s
2 m/s
Tsi384
20.9
°
C/W
19.2
°
C/W
18.5
°
C/W
Содержание TSI384
Страница 1: ... IDT Tsi384 PCIe to PCI Bridge User Manual May 5 2014 ...
Страница 10: ...Contents 10 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 36: ...2 Signal Descriptions 36 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 56: ...4 Addressing 56 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 62: ...5 Configuration Transactions 62 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 74: ...6 Bridging 74 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 78: ...7 PCI X Arbitration 78 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 128: ...11 Power Management 128 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 136: ...12 Serial EEPROM 136 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 142: ...13 JTAG 142 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 268: ...16 Packaging 268 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 276: ...276 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...
Страница 280: ...Index 280 Tsi384 User Manual May 5 2014 Integrated Device Technology www idt com ...