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Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
253
Functional Specifications
Features and
Functions
Remarks
Basic function
Supports a maximum of 20 100M/1000M interfaces. Services on each
interface can be configured.
Reliability and
availability
Support for hot swap
Restrictions and
Remarks
Not applicable to outdoor scenarios, a chassis supports a maximum of
five subcards of this type.
Technical Specifications
Table 7-297
Interface specifications
Attribute
Description
Optical type supported
8.2 155Mbps SFP Electrical Transceiver
8.3 155Mbps eSFP Optical Module
8.4 155Mbps eSFP BIDI Optical Module
8.6 1Gbps Electrical Transceiver
8.9 1.25Gbps eSFP Optical Module
8.11 1.25Gbps eSFP CWDM Optical Module
8.10 1.25Gbps eSFP BIDI Optical Module
8.12 125M~2.67Gbps eSFP DWDM Optical Module
Working mode
Full-duplex
Compliant standard
IEEE 802.3
Frame format
Ethernet_II, Ethernet_SAP, and Ethernet_SNAP
Table 7-298
Board specifications
Item
Specification
Dimensions (H x W x D)
39.6mm x 193.8mm x 209.3 mm (1.56 in. x 7.63 in. x 8.24
in.)
Typical power
consumption
49.0 W
Typical heat dissipation
159.0 BTU/hour
Weight
1.0 kg (2.2 lb)
Ambient temperature
Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms:
-5 °C to 55 °C (23°F to 131°F)