HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Electrical and Reliability Features
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
62
Item
Test Condition
Standard
Sample size
Results
Drop test
0.8 m in height. Drop the
module on the marble
terrace with one surface
facing downwards, six
surfaces should be
tested.
Operation mode: no
power, no package
IEC60068-
2-32
3 pcs/group
Visual inspection:
ok
Function test: ok
RF specification: ok
Life
High
temperature
operating life
Temperature: 85ºC
Operation mode: working
with service connected
Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point
JESD22-A1
08-B
50 pcs/group
Visual inspection:
ok
Function test: ok
RF specification: ok
High
temperature
& high
humidity
High temperature: 85ºC
Humidity: 85%
Operation mode: powered
on and no working
Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point
JESD22-A1
10-B
50 pcs/group
Visual inspection:
ok
Function test: ok
RF specification: ok
Temperature
cycle-Non
operating
High temperature: 85ºC
Low temperature:
–40ºC
Temperature change
slope: 6ºC/min
Operation mode: no
power
Test duration: 168 h,
336 h, 500 h, 1000 h for
inspection point
JESD22-A1
04-C
50 pcs/group
Visual inspection:
ok
Function test: ok
RF specification: ok
ESD
HBM
(Human
Body Model)
2 kV (Class 1 B)
Operation mode: no
power
JESD22-A1
14-D
3 pcs/group
Visual inspection:
ok
Function test: ok
RF specification: ok
ESD with
DVK (or
embedded in
the host)
Contact Voltage: ±2 kV,
±4 kV
Air Voltage: ±2 kV, ±4 kV,
±8 kV
Operation mode: working
with service connected
IEC61000-
4-2
2 pcs
Visual inspection:
ok
Function test: ok
RF specification: ok
Groups
≥ 2