Huawei MU609T Скачать руководство пользователя страница 6 | Manualshive

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PCB Design

PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows: the sizes of the solder pads on customers'
PCBs are the same as those of the module's solder pads for the high production
efficiency and high reliability of solder joints. For details, see the following figure:

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Содержание MU609T

Страница 1: ...olders under licenses Trademarks and Permissions and are trademarks or registered trademarks of Huawei Technologies Co Ltd Other trademarks product service and company names mentioned are the property of their respective owners Notice Some features of the product and its accessories described herein rely on the software installed capacities and settings of local network and may not be activated or...

Страница 2: ...ABLE LAW IN NO CASE SHALL HUAWEI TECHNOLOGIES CO LTD BE LIABLE FOR ANY SPECIAL INCIDENTAL INDIRECT OR CONSEQUENTIAL DAMAGES OR LOST PROFITS BUSINESS REVENUE DATA GOODWILL OR ANTICIPATED SAVINGS Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and will obtain all necessary governmental permits and licenses in order to export re export or...

Страница 3: ...i Contents Getting to Know the MU609T 1 PCB Design 3 Assembly 5 ...

Страница 4: ...tion the process for PCB Design Assembly and safety precautions You are recommended to read the manual before using the MU609T Getting to Know the MU609T The package of the LGA module is 140 pin LGA with a dimension of 40 mm 40 mm 4 0 mm It is applied to the user interface board and can be used as a wireless terminal in a network environment ...

Страница 5: ...2 35 56 35 56 29 26 18 54 18 54 30 14 3 25 7 32 2 44 4X2 0 4X2 0 35X3 0 35X3 0 3 0 3 0 135 2 0 3X0 6 3X1 0 97X1 8 97X1 2 A 5 1 B C 5 1 D 5 1 E 5 1 Bottom view ...

Страница 6: ... reliability it is recommended that the PCB pad size be designed as follows the sizes of the solder pads on customers PCBs are the same as those of the module s solder pads for the high production efficiency and high reliability of solder joints For details see the following figure ...

Страница 7: ...ended No mm mil k 36 65 1442 8 o 35 56 1400 p 30 14 1186 8 q 29 26 1152 we 2 44 96 te 3 71 146 r 18 54 730 u 24 38 960 y 3 25 128 x 7 32 288 z 9 76 384 v 14 64 576 ba 3 05 120 bb 2 03 80 bc 1 22 48 bd 1 83 72 be 1 02 40 bf 0 61 24 ...

Страница 8: ...de for assembly Design of Solder Mask The PCB pad design can be solder mask defined SMD or non solder mask defined NSMD NSMD is recommended In addition the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved The solder mask must be 100 µm to150 µm larger than the pad that is the single side of the solder mask must be 50 µm to 75 µm large...

Страница 9: ...3 30 7 32 2 44 4X2 03 4X2 08 35X3 05 35X3 05 3 05 3 05 2 05 3X0 65 3X1 00 97X1 88 97X1 22 A 5 1 B 5 1 C 5 1 D 5 1 E 5 1 3 71 9 76 14 64 36 70 29 26 24 38 2 44 3 71 36 70 30 09 4X0 2 3X0 2 97X0 2 0 3 0 2 1 3 5 4 5 4 5 1 27 1 27 1 27 1 27 X Y ...

Страница 10: ... divide the pad with the angle of 45 D Elongate the stencil opening 0 05 mm with the reverse direction for the adjacent pad but will not reduce the air gap and add an isolation bridge with 0 2 mm width at the X axis direction E Elongate the stencil opening 0 05 mm with the X direction and add an isolation bridge with 0 2 mm width at the axis direction Reflow Profile For the soldering temperature o...

Страница 11: ...Key Parameter Preheat zone 40 C 150 C 60s 120s Heating rate 0 5 C s 2 C s Soak zone 150 C 200 C t1 t2 60s 120s Heating rate 1 0 C s Reflow zone 217 C t3 t4 30s 90s Peak reflow temperature 230 C 250 C Cooling zone Cooling rate 1 C s Slope 4 C s ...

Страница 12: ...9 ...

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