HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
Mechanical Specifications
Issue 02 (2016-09-07)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
68
dimensions (W x D) of the thermal conductive material are 38 mm x 28 mm (1.50
in. x 1.10 in.), and its height depends on the height of the Mini PCIe connector
you use and the method for installing the Mini PCIe. When deciding the height of
the thermal conductive material, you are advised to obey the following rule: After
the Mini PCIe is fastened to the customer PCB, the compression amount of the
thermal conductive material accounts for 15% to 30% of the thermal conductive
material size. For example, if you use a connector shown in the following figure
and install the Mini PCIe like this, the recommended height of the thermal
conductive material is 1.8 mm (0.07 in.).
On the customer PCB, reserve two metal screw holes, which are connected to
the PCB ground plane. When installing the Mini PCIe, use two metal screws to
fasten the Mini PCIe to the customer PCB. See the following figure.
Ensure that the air flow around the Mini PCIe is sufficient.
Try not to place any component in the Mini PCIe's projection region on the
customer PCB. Do not place components with 1.5 W or higher power
consumption or heat sensitive components (such as crystals) near the Mini PCIe.
Use a large customer PCB. The recommended size (W x D) is 70 mm x 70 mm
(2.76 in. x 2.76 in.).
If the thermal conductive material is attached between the Mini PCIe and the
customer PCB, then the heat dissipation performance will be better for multilayer
PCB.
Apply copper to the region for attaching the thermal conductive material to the
customer PCB. Try to use the continuous ground plane design on the customer
PCB, and each ground plane must be connected through holes. Therefore,
reserve holes as many as possible.
Thermal Conductive Material
Mini PCIe
Customer PCB
Customer PCB
Thermal Conductive Material
Mini PCIe
Screw