HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Mechanical Specifications
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
71
6.9 Specification of Rework
6.9.1
Process of Rework
6.9.2
Preparations of Rework
Remove barrier or devices that can’t stand high temperature before rework.
If the device to be reworked is beyond the storage period, bake the device
according to Table 6-1 .
6.9.3
Removing of the Module
The solder is molten and reflowed through heating during the module removing
process. The heating rate must be quick but controllable in order to melt all the solder
joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,
and their solder joints against heating or mechanical damages.
The LGA module has many solder pads and the pads are large. Therefore, common
soldering irons and heat guns cannot be used in the rework. Rework must be done using
either infrared heating rework stations or hot air rework stations. Infrared heating rework
stations are preferred, because they can heat components without touching them. In
addition, infrared heating rework stations produce less solder debris and less impact on
modules, while hot air rework stations may cause shift of other components not to be
reworked.
It is proposed that a special clamp is used to remove the module.
