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HUAWEI ME909 Series LTE LGA Module
Hardware Guide

Contents

Issue V0.3 (2013-05-21)

Huawei Proprietary and Confidential

6.8.1 General Description of Assembly Processes ........................................................................ 68

6.8.2 Stencil Design ........................................................................................................................ 68

6.8.3 Reflow Profile ........................................................................................................................ 69

6.9 Specification of Rework .................................................................................................................. 71

6.9.1 Process of Rework ................................................................................................................ 71

6.9.2 Preparations of Rework ......................................................................................................... 71

6.9.3 Removing of the Module........................................................................................................ 71

6.9.4 Welding Area Treatment ........................................................................................................ 72

6.9.5 Module Installation ................................................................................................................. 72

6.9.6 Specifications of Rework ....................................................................................................... 73

7 Certifications ................................................................................................................................ 74

7.1 About This Chapter ......................................................................................................................... 74

7.2 Certifications ................................................................................................................................... 74

8 Safety Information ...................................................................................................................... 75

8.1 Interference .................................................................................................................................... 75

8.2 Medical Device ............................................................................................................................... 75

8.3 Area with Inflammables and Explosives ......................................................................................... 75

8.4 Traffic Security ................................................................................................................................ 76

8.5 Airline Security ................................................................................................................................ 76

8.6 Safety of Children ........................................................................................................................... 76

8.7 Environment Protection .................................................................................................................. 76

8.8 WEEE Approval .............................................................................................................................. 76

8.9 RoHS Approval ............................................................................................................................... 76

8.10 Laws and Regulations Observance ............................................................................................. 77

8.11 Care and Maintenance ................................................................................................................. 77

8.12 Emergency Call ............................................................................................................................ 77

8.13 Regulatory Information ................................................................................................................. 77

8.13.1 CE Approval (European Union) ........................................................................................... 77

8.13.2 FCC Statement .................................................................................................................... 78

9 Appendix A Circuit of Typical Interface ................................................................................ 79

10 Appendix B Acronyms and Abbreviations .......................................................................... 80

Содержание ME909 Series

Страница 1: ...HUAWEI ME909 Series LTE LGA Module Hardware Guide Issue V0 3 Date 2013 05 21 ...

Страница 2: ...marks product service and company names mentioned are the property of their respective owners Notice Some features of the product and its accessories described herein rely on the software installed capacities and settings of local network and may not be activated or may be limited by local network operators or network service providers thus the descriptions herein may not exactly match the product...

Страница 3: ...nologies Co Ltd 3 About This Document Revision History Document Version Date Chapter Descriptions V0 1 2013 01 21 Draft brief version V0 2 2013 02 07 Draft brief version Reserve some interfaces Explain UART2 for debugging Fix a mistake Pin 27 should be reserved V0 3 2013 05 21 This is a draft version with full content and some test data is still TBD ...

Страница 4: ...22 3 3 1 Overview 22 3 3 2 Power Supply VBAT Interface 23 3 3 3 Output Power Supply Interface 24 3 4 Signal Control Interface 24 3 4 1 Overview 24 3 4 2 Power on off POWER_ON_OFF Pin 25 3 4 3 RESIN_N Pins 26 3 4 4 WAKEUP_IN Signal 28 3 4 5 WAKEUP_OUT Signal 29 3 4 6 SLEEP_STATUS Signal 30 3 4 7 LED Pin 30 3 5 UART Interface 31 3 5 1 Overview 31 3 5 2 Circuit Recommended for the UART Interface 32 3...

Страница 5: ...2 Interference 47 4 5 3 Antenna Requirements 47 4 5 4 Radio Test Environment 48 5 Electrical and Reliability Features 50 5 1 About This Chapter 50 5 2 Absolute Ratings 50 5 3 Operating and Storage Temperatures and Humidity 51 5 4 Electrical Features of USIM 51 5 5 Electrical Features of Application Interfaces 52 5 6 Power Supply Features 52 5 6 1 Input Power Supply 52 5 6 2 Power Consumption 53 5 ...

Страница 6: ... 72 6 9 6 Specifications of Rework 73 7 Certifications 74 7 1 About This Chapter 74 7 2 Certifications 74 8 Safety Information 75 8 1 Interference 75 8 2 Medical Device 75 8 3 Area with Inflammables and Explosives 75 8 4 Traffic Security 76 8 5 Airline Security 76 8 6 Safety of Children 76 8 7 Environment Protection 76 8 8 WEEE Approval 76 8 9 RoHS Approval 76 8 10 Laws and Regulations Observance ...

Страница 7: ...his document helps hardware engineer to understand the interface specifications electrical features and related product information of the ME909 module In addition some significant hardware differences between ME909 and MU609 MU509 MC509 will be clearly described in the document HUAWEI LGA Module Hardware Migration Guide Table 1 1 ME909 series product name Product name Description State ME909u 521...

Страница 8: ...re Description Physical dimensions Dimensions L W H 30 mm 30 mm 2 35 mm Weight about 5 g Operating Bands ME909u 521 LTE FDD Band 1 2 3 5 7 8 20 all bands with diversity WCDMA HSDPA HSUPA HSPA Band 1 2 5 8 all bands with diversity GSM GPRS EDGE 850 900 1800 1900 MHz GPS GLONASS L1 Operating Temperature Normal operating temperature 20 C to 70 C Extended operating temperature 1 30 C to 75 C Storage T...

Страница 9: ...wire UART 3 GPIOx5 Power on off pin Hardware reset pin Sleep indicator pin SLEEP_STATUS HSIC interface 4 Tunable Antenna control 4 GPIOs SD interface 4 SPI interface 4 I2C interface 4 JTAG Antenna interface Main AUX GPS ADCx2 4 Power supply Antenna interface WWAN MAIN antenna pad x1 WWAN AUX antenna pad x1 GPS antenna pad x1 Data Services ME909u 521 GPRS DL 85 6 kbps UL 85 6 kbps EDGE DL 236 8 kbp...

Страница 10: ...5 and 3GPP TS 34 121 1 specifications 2 Currently firmware supports one 2 wire UART only 3 This is only used for debugging 4 These interfaces are reserved for intelligent module in future 2 3 Circuit Block Diagram Figure 2 1 shows the circuit block diagram of the ME909 module The major functional units of the ME909 module contain the following parts Power management Baseband controller Multi chip ...

Страница 11: ...d USIM Interface The USIM interface provides the interface for a USIM card External Power Supply DC 3 8 V is recommended Audio Interface The module supports one PCM interface This function is under development RF Pad RF antenna interface Tunable ANT CTRL Since LTE bands cover wide frequency tunable ANT CTRL helps customer for tunable antenna design This function is under development ADC Reserved f...

Страница 12: ...y describes the external application interfaces of the ME909 module including LGA Interface Power Interface Signal Control Interface UART Interface USB Interface USIM Card Interface Audio Interface General Purpose I O Interface JTAG Interface RF Antenna Interface Reserved Interface NC Interface Tunable Antenna Control 3 2 LGA Interface The ME909 module uses a 145 pin LGA as its external interface ...

Страница 13: ...ttom view JTAG pads Reserved pads GND pads Power pads Control pads UART pads USB pads RF ANT pads GPIO pads SIM pads Audio pads 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 101 116 114 113 112 110 107 111 109 108 106 105 104 103 102 52 54 55 56 57 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81...

Страница 14: ...UX Min Typ Max 1 UART1_TX O UART1 transmit output 0 3 1 8 2 1 2 UART1_RTS O UART1 Ready for receive 0 3 1 8 2 1 3 UART1_CTS I UART1 Clear to Send 0 3 1 8 2 1 4 UART1_RX I UART1 receive data input 0 3 1 8 2 1 5 PCM_SYNC O PCM interface sync 0 3 1 8 2 1 6 PCM_DIN I PCM interface data in 0 3 1 8 2 1 7 PCM_DOUT O PCM interface data out 0 3 1 8 2 1 8 PCM_CLK O PCM interface clock 0 3 1 8 2 1 9 Reserved...

Страница 15: ...n open 19 Reserved Reserved must keep this pin open 20 Reserved Reserved must keep this pin open 21 ANT_TUNE0 O Tunable antenna control signal bit 0 0 3 1 8 2 1 22 ANT_TUNE1 O Tunable antenna control signal bit 1 0 3 1 8 2 1 23 ANT_TUNE2 O Tunable antenna control signal bit 2 0 3 1 8 2 1 24 ANT_TUNE3 O Tunable antenna control signal bit 3 0 3 1 8 2 1 25 NC Not connected please keep this pin open 2...

Страница 16: ... Not connected please keep this pin open 38 NC Not connected please keep this pin open 39 NC Not connected please keep this pin open 40 NC Not connected please keep this pin open 41 NC Not connected please keep this pin open 42 JTAG_TCK I JTAG clock input 0 3 1 8 2 1 43 Reserved Reserved must keep this pin open 44 Reserved Reserved must keep this pin open 45 Reserved Reserved must keep this pin op...

Страница 17: ...ved Reserved must keep this pin open 61 Reserved Reserved must keep this pin open 62 Reserved Reserved must keep this pin open 63 Reserved Reserved must keep this pin open 64 Reserved Reserved must keep this pin open 65 Reserved Reserved must keep this pin open 66 Reserved Reserved must keep this pin open 67 Reserved Reserved must keep this pin open 68 Reserved Reserved must keep this pin open 69 ...

Страница 18: ... 2 1 79 Reserved Reserved must keep this pin open 80 UART0_CTS I UART0 Clear to Send 0 3 1 8 2 1 81 POWER_ON_OFF I System power on or power off Pulled up on module 82 NC Not connected please keep this pin open 83 NC Not connected please keep this pin open 84 NC Not connected please keep this pin open 85 USB_DM I O USB Data defined in the USB 2 0 Specification 86 USB_DP I O USB Data defined in the ...

Страница 19: ...ot connected please keep this pin open 99 NC Not connected please keep this pin open 100 RESIN_N I Reset module this pin is pulled up on module 0 3 1 8 2 1 101 LED_MODE O Mode indicator Current sink Drive strength 10 mA 102 Reserved Reserved must keep this pin open 103 NC Not connected please keep this pin open 104 Reserved Reserved must keep this pin open 105 GPIO I O General I O pins The functio...

Страница 20: ...und 117 NC Not connected please keep this pin open 118 NC Not connected please keep this pin open 119 NC Not connected please keep this pin open 120 NC Not connected please keep this pin open 121 GND Thermal Ground Pad this pad need thermal via 122 GND Thermal Ground Pad this pad need thermal via 123 GND Thermal Ground Pad this pad need thermal via 124 GND Thermal Ground Pad this pad need thermal ...

Страница 21: ...GND Thermal Ground Pad this pad need thermal via 132 GND Thermal Ground Pad this pad need thermal via 133 GND Thermal Ground Pad this pad need thermal via 134 GND Thermal Ground Pad this pad need thermal via 135 GND Thermal Ground Pad this pad need thermal via 136 GND Thermal Ground Pad this pad need thermal via 137 GND Thermal Ground Pad this pad need thermal via 138 GND Thermal Ground Pad this p...

Страница 22: ...g and there are no signal connected to these pins Yet some of these pins may be used in MU509 MC509 and MU609 module therefore before you deal with these pins please refer to the corresponding hardware guide The Reserved pins are internally connected to the module Therefore these pins should not be used otherwise they may cause problems Please contact with us for more details about this informatio...

Страница 23: ...ply When the ME909 module works at 2G mode and transmits signals at the maximum power the transient current may reach the transient peak value of about 2 5 A due to the differences in actual network environments In this case the VBAT voltage drops If you want wireless good performance please make sure that the voltage does not decrease below 3 3 V in any case Otherwise exceptions such as restart o...

Страница 24: ... mA typical value for external level conversion or other applications If the ME909 module is in sleep mode the output power supply interface is in the low power consumption state 500 μA If the ME909 module is in power down mode the output power supply is in the disabled state Through the SIM_VCC power supply interface the ME909 module can supply 1 8 V or 2 85 V power to USIM card The transient cur...

Страница 25: ...hold 1s high level voltage pulse and then output low level voltage L Do not wake up the host default value 0 3 1 8 2 1 15 SLEEP_STATUS O Indicates sleep status of ME909 H ME909 is in wakeup state L ME909 is in sleep state 0 3 1 8 2 1 101 LED_MODE O Mode indicator Current sink Drive strength 10 mA Under development 3 4 2 Power on off POWER_ON_OFF Pin The ME909 module can be controlled to be powered...

Страница 26: ... never needed for this pin Figure 3 5 Connections of the RESIN_N pin As the RESIN_N and POWER_ON_OFF signals are relatively sensitive it is recommended that you install a 10 nF 0 1 µF capacitor near the RESIN_N and POWER_ON_OFF pins of the interface for filtering In addition when you design a circuit on the PCB of the interface board it is recommended that the circuit length not exceed 20 mm and t...

Страница 27: ...ot up During power on timing please make sure the VBAT is stable Figure 3 6 Power on timing sequence Table 3 5 Power on timing Parameter Comments Time Nominal values Units TPON POWER_ON_OFF turn on time 0 5 1 0 s TPD POWER_ON_OFF Valid to USB D high 12 s If the DTE needs to detect the PID VID of module during the BIOS phase the detection time should exceed the TPD time Figure 3 7 Power off timing ...

Страница 28: ...e 3 8 When a low level pulse is supplied through the RESIN_N pin the hardware will be reset After the hardware is reset the software starts powering on the module and reports relevant information according to the actual settings For example the AT command automatically reports SYSSTART Figure 3 8 Reset pulse timing The RESIN_N pin must not be pulled down for more than 1s 3 4 4 WAKEUP_IN Signal WAK...

Страница 29: ... 29 Figure 3 9 Connections of the WAKEUP_IN pin The pull up resistor should not be greater than 22 kΩ 3 4 5 WAKEUP_OUT Signal The WAKEUP_OUT signal is used to wake up the external devices Its drive current is no more than 2 mA Table 3 3 shows the definition of the WAKEUP_OUT signal Figure 3 10 shows recommended circuit of the WAKEUP_OUT pin Figure 3 10 Connections of the WAKEUP_OUT pin ...

Страница 30: ... sleep mode by reading SLEEP_STATUS pin When SLEEP_STATUS pin is in high level ME909 is in wakeup state When SLEEP_STATUS pin is in low level ME909 is in sleep state Its drive current is no more than 2 mA Figure 3 11 shows recommended circuit of the SLEEP_STATUS pin Figure 3 11 Connections of the SLEEP_STATUS pin 3 4 7 LED Pin This function is under development External Circuits Figure 3 12 shows ...

Страница 31: ...re UART and UART1 is not supported at the moment The UART2 2 wire UART is for debugging only Customer should layout two test points for them in case system trouble shooting and analysis Table 3 7 lists the UART interface signals Table 3 7 UART interface signals Pin No Pin Name I O Description DC Characteristics V Min Typ Max 76 UART0_TX O UART0 transmit output 0 3 1 8 2 1 78 UART0_RX I UART0 recei...

Страница 32: ...UART In this connection the Complementary Metal Oxide Semiconductor CMOS logic level and the Electronic Industries Association EIA level are converted mutually For example it is recommended that you use the MAX218 chip The MAX218 s max baud is 120000 bit s with a 2 wire serial port It is recommended that customer set the pins related to UART interface as test points on the DTE board for debugging ...

Страница 33: ... D According to USB protocol for bus timing or electrical characteristics of ME909 USB signal please refer to the chapter 7 3 2 of Universal Serial Bus Specification 2 0 Figure 3 14 Recommended circuit of USB interface Since the USB interface of ME909 module supports USB 2 0 high speed the resistance RV102 and RV103 in the Figure 3 14 must be Voltage Sensitive Resistor with small capacitance ALVC1...

Страница 34: ...USIM cards Table 3 9 USIM card interface signals Pin No Pin Name I O Description DC Characteristics V Min Typ Max 88 SIM_RESET O USIM card reset 1 8 2 85 90 SIM_CLK O USIM card clock 1 8 2 85 89 SIM_DATA I O USIM card data 1 8 2 85 34 SIM_VCC P Power supply for USIM card 1 8 2 85 3 7 2 Circuit Recommended for the USIM Card Interface As the ME909 module is not equipped with an USIM socket you need ...

Страница 35: ... Three 33 pF capacitors are placed between the SIM_DATA and Ground pins the SIM_RESET and Ground pins and the SIM_CLK and Ground pins in parallel to filter interference from RF signals SIM_DATA is already pulled up internally It is recommended to take electrostatic discharge ESD protection measures near the USIM card socket The TVS diode with Vrwm of 5 V and junction capacitance less than 10 pF mu...

Страница 36: ... on the related interface to prevent electrostatic discharge and protect integrated circuit IC components The signal level of CODEC must match that of the ME909 module 3 9 General Purpose I O Interface The ME909 module provides 5 GPIO pins for customers to use for controlling signals which are worked at 1 8 V CMOS logic levels Customers can use AT command to control the state of logic levels of 5 ...

Страница 37: ...G interface Pin No Pin Name I O Description DC Characteristics V Min Typ Max 30 JTAG_TMS I JTAG test mode selection 0 3 1 8 2 1 36 JTAG_TRST_N I JTAG test reset 0 3 1 8 2 1 42 JTAG_TCK I JTAG test clock 0 3 1 8 2 1 72 JTAG_TDO O JTAG test data output 0 3 1 8 2 1 87 JTAG_TDI I JTAG test serial data input 0 3 1 8 2 1 93 JTAG_RTCK O JTAG test clock return signal 0 3 1 8 2 1 14 PS_HOLD I Power supply ...

Страница 38: ...ction as follow The 1 kΩ resistor and 4 7 nFcapacitor must be placed as close as possible to ME909 3 11 RF Antenna Interface The ME909 module provides three antenna pads MAIN_ANT GPS_ANT and AUX_ANT for connecting the external antennas Route the antenna pad as close as possible to antenna connector In addition the impedance of RF signal traces must be 50 Ω Table 3 13 Definition of the antenna pads...

Страница 39: ...ld not be connected Please keep these pins open Table 3 15 NC pin Pin No Pin Name I O Description 25 26 31 33 37 41 82 84 94 99 103 117 120 NC Not connected please keep open 3 14 Tunable Antenna Control The module provides 4 tunable antenna control pins This function is under development Table 3 16 List of tunable antenna control pins Pin No Pin Name I O Description DC Characteristics V Min Typ Ma...

Страница 40: ...ies Table 4 1 shows the RF bands supported by ME909u 521 Table 4 1 RF bands of ME909u 521 Operating Band Tx Rx UMTS Band I 1920 MHz 1980 MHz 2110 MHz 2170 MHz UMTS Band II 1850 MHz 1910 MHz 1930 MHz 1990 MHz UMTS Band V 824 MHz 849 MHz 869 MHz 894 MHz UMTS Band VIII 880 MHz 915 MHz 925 MHz 960 MHz GSM 850 824 MHz 849 MHz 869 MHz 894 MHz GSM 900 880 MHz 915 MHz 925 MHz 960 MHz GSM 1800 DCS 1710 MHz...

Страница 41: ...cable for testing L08 C014 350 of DRAKA COMTEQ or Rosenberger Cable length 29 cm The compensation for different frequency bands relates to the cable and the test environment The instrument compensation needs to be set according to the actual cable conditions 4 3 2 Test Standards Huawei modules meet 3GPP TS 51 010 1 3GPP TS 34 121 1 and 3GPP TS 36 521 1 test standards Each module passes strict test...

Страница 42: ...43 102 TBD TBD 8PSK MCS5 BLER 10 98 TBD TBD GSM1900 GMSK BER 2 43 102 TBD TBD 8PSK MCS5 BLER 10 98 TBD TBD UMTS Band I BER 0 1 106 7 TBD TBD UMTS Band II BER 0 1 104 7 TBD TBD UMTS Band V BER 0 1 106 7 TBD TBD UMTS Band VIII BER 0 1 103 7 TBD TBD LTE Band I FDD QPSK throughput 95 96 3 10 MHz TBD TBD LTE Band II FDD QPSK throughput 95 94 3 10 MHz TBD TBD LTE Band III FDD QPSK throughput 95 93 3 10 ...

Страница 43: ...tested at the antenna pad can transmit According to the 3GPP protocol the required transmit power varies with the power class Table 4 4 lists the required ranges of the conducted transmit power of ME909 The tested values listed in the Test Value column must range from the minimum power to the maximum power Table 4 4 ME909u 521 conducted Tx power unit dBm Item 3GPP Protocol Claim dBm ME909u 521 Tes...

Страница 44: ... RB 0 QPSK Partial RB 1 16QAM 1 RB Partial RB 1 16QAM Partial RB 2 4 5 Antenna Design Requirements 4 5 1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna The radiated power of an antenna is always lower than the input power due to the following antenna losses return loss material loss and coupling loss T...

Страница 45: ...ortant than the efficiency and S11 has not strong correlation to wireless performance S21 indicates the isolation between two antennas Isolation For a wireless device with multiple antennas the power of different antennas is coupled with each other Antenna isolation is used to measure the power coupling The power radiated by an antenna might be received by an adjacent antenna which decreases the a...

Страница 46: ...ry Secondary GPS antenna omnidirectional In addition the secondary antenna s pattern should be complementary with the primary antenna s pattern Gain and Directivity The radiation pattern of an antenna represents the field strength of the radiated electromagnetic waves in all directions but not the power density that the antenna radiates in the specific direction The directivity of an antenna howev...

Страница 47: ...nterference sources emit interference signals that affect the normal operation of the module For example the module sensitivity can be decreased due to interference signals Therefore during the design you need to consider how to reduce the effects of interference sources on the module You can take the following measures Use an LCD with optimized performance shield the LCD interference signals shie...

Страница 48: ... 2 1 1 5 1 for GPS antenna 4 5 4 Radio Test Environment The antenna efficiency antenna gain radiation pattern total radiated power TRP and total isotropic sensitivity TIS can be tested in a microwave testing chamber Huawei has a complete set of OTA test environments SATIMO microwave testing chambers and ETS microwave testing chambers The testing chambers are certified by professional organizations...

Страница 49: ...EI ME909 Series LTE LGA Module Hardware Guide RF Specifications Issue V0 3 2013 05 21 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 49 Figure 4 1 SATIMO microwave testing chamber ...

Страница 50: ...erfaces in the ME909 module including Absolute Ratings Operating and Storage Temperatures and Humidity Electrical Features of USIM Power Supply Features Reliability Features EMC and ESD Features 5 2 Absolute Ratings Table 5 1 lists the absolute ratings for the ME909 module Using the ME909 module beyond these conditions may result in permanent damage to the module Table 5 1 Absolute ratings for the...

Страница 51: ...r storage 40 85 C Moisture 5 95 1 When the ME909 module works at this temperature all its RF specifications comply with the 3GPP and 3GPP2 CDMA RF specifications 2 The temperatures outside of the range 20 C to 70 C the module might slightly deviate from the 3GPP and 3GPP2 CDMA RF specifications 5 4 Electrical Features of USIM Table 5 3 Electrical features of Digital Pins in the I O supply domain o...

Страница 52: ...H Logic high level input voltage 0 65 x VDD_PX VDD_PX 0 3 V VIL Logic low level input voltage 0 3 0 35 x VDD_PX V VOH Logic high level output voltage VDD_PX 0 45 VDD_PX V VOL Logic low level output voltage 0 0 45 V 5 6 Power Supply Features 5 6 1 Input Power Supply Table 5 5 lists the requirements for input power of the ME909 module Table 5 5 Requirements for input power for the ME909 module Param...

Страница 53: ...l values are measured at room temperature and minimum and maximum values are measured over the entire operating temperature range Table 5 7 Averaged Power off DC power consumption Description Test Value Units Notes Configuration Power off TBD µA VBAT is ON and the module does not work Table 5 8 Averaged standby DC power consumption Description Bands Test Value Units Notes Configuration LTE Standby...

Страница 54: ...nd idle DRX cycle 8 2 56 s Module is registered on the 3G network and PDP is activated No data transmission USB is not in suspend mode GSM GPRS EDGE Idle GSM bands TBD mA Module power up and idle MFRMS 5 1 175 s Module is registered on the 2G network and PDP is activated No data transmission USB is not in suspend mode Radio Off Any band TBD mA Flight mode USB is in suspend mode Table 5 9 DC power ...

Страница 55: ...Bm Tx Power TBD 10 dBm Tx Power TBD 23 5 dBm Tx Power Band II PCS 1900 TBD mA 1 dBm Tx Power TBD 10 dBm Tx Power TBD 23 5 dBm Tx Power Band V 850 MHz TBD mA 1 dBm Tx Power TBD 10 dBm Tx Power TBD 23 5 dBm Tx Power Band VIII 900 MHz TBD mA 1 dBm Tx Power TBD 10 dBm Tx Power TBD 23 5 dBm Tx Power LTE LTE Band I TBD mA 1 dBm Tx Power TBD 10 dBm Tx Power TBD 23dBm Tx Power LTE Band II TBD mA 1 dBm Tx ...

Страница 56: ... 10 dBm Tx Power TBD 23 dBm Tx Power LTE Band XX TBD mA 1 dBm Tx Power TBD 10 dBm Tx Power TBD 23 dBm Tx Power Table 5 10 DC power consumption of ME909u 521 GPRS EDGE Description Test Value Units PCL Configuration GPRS850 TBD mA 5 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down TBD mA 10 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down GPRS900 TBD mA 5 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down TBD mA 10 ...

Страница 57: ...D mA 10 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down EDGE850 TBD mA 8 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down TBD mA 15 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down EDGE900 TBD mA 8 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down TBD mA 15 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down EDGE1800 TBD mA 2 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down TBD mA 10 1 Up 1 Down TBD 2 Up 1 Down TBD 4 Up 1 Down ED...

Страница 58: ... the reliability of the ME909 module Table 5 12 Test conditions and results of the reliability of the ME909 module Item Test Condition Standard Low temperature storage Temperature 40º C 2º C Test duration 24 h IEC60068 High temperature storage Temperature 85º C 2º C Test duration 24 h IEC60068 Low temperature working Temperature 30º C 2º C Test duration 24 h IEC60068 High temperature working Tempe...

Страница 59: ...ach axial direction IEC60068 Clash test Half sine wave Peak acceleration 180 m s2 Pulse duration 6 ms Repetition time 6 directions 1000 times for each direction IEC60068 Drop test First case 0 3 m in height Drop the ME909 module on the marble terrace with one surface facing downwards twice Six surfaces should be tested Second case 0 8 m in height Drop the ME909 module on the marble terrace with on...

Страница 60: ... the USIM interface lines preferably 10 cm EMC protection on audio input output filters against 900MHz emissions Biasing of the microphone inputs Ground plane HUAWEI recommends a common ground plane for analog digital RF grounds A metallic or plastic case with conductive paint is recommended except for the area around the antenna The HUAWEI ME909 Module does not include any protection against over...

Страница 61: ... module must be stored and sealed properly in vacuum package under a temperature below 40 C and the relative humidity less than 90 in order to ensure the weldability within 12 months 6 3 Moisture Sensitivity The moisture sensitivity is level 3 After unpacking the module must be assembled within 168 hours under the environmental conditions that the temperature is lower than 30 C and the relative hu...

Страница 62: ...pecifications Issue V0 3 2013 05 21 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 62 Moving storing and processing the product must comply with IPC JEDEC J STD 033 6 4 Dimensions and interfaces Figure 6 1 shows the dimensions in details ...

Страница 63: ...UAWEI ME909 Series LTE LGA Module Hardware Guide Mechanical Specifications Issue V0 3 2013 05 21 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 63 Figure 6 1 Dimensions unit mm ...

Страница 64: ...ayers ESD pallet anti vibration foam and vacuum packing into cartons All materials used must meet eco friendly requirements According to the requirements and test methods specified in EIA 541 the surface resistance must range from 10 000 Ω to 1000 000 Ω Packaging materials must be resistant to temperature higher than or equal to 150 C Triboelectricity must be lower than 100 V The following figure ...

Страница 65: ...ach the packages with labels indicating that the LGA modules contained in the packages are MSL 3 components Packages must be made of ESD materials Packages or containers must be attached with ESD labels 6 6 Label The label is made from deformation resistant fade resistant and high temperature resistant material and is able to endure the high temperature of 260 C Orient LGA modules in the specified...

Страница 66: ...ch used have to make satisfied with the EU WEEE and RoHS directives The label must be heated up for 20s 40s and able to endure the high temperature of 260 C And the color of the material of the nameplate cannot change 6 7 Customer PCB Design 6 7 1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel immersion Gold ENIG Organic Solderability Preservative OSP may also be used ...

Страница 67: ...re Guide Mechanical Specifications Issue V0 3 2013 05 21 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 67 Figure 6 3 Footprint design of customer s PCB unit mm Figure 6 4 Thermal Pads design of customer s PCB unit mm ...

Страница 68: ...ices must be located more than 3 mm 5 mm recommended away from the LGA module The minimum distance between the LGA module and the PCB edge is 0 5 mm When the PCB layout is double sided it is recommended that the LGA module be placed on the second side for assembly so as to avoid module dropped from PCB or component located in module re melding defects caused by uneven weight 6 8 Assembly Processes...

Страница 69: ...Co Ltd 69 Figure 6 5 Recommended stencil design of LGA module unit mm The stencil design has been qualified for HUAWEI motherboard assembly customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect 6 8 3 Reflow Profile For the soldering temperature of the LGA module see the following figure ...

Страница 70: ...awei Technologies Co Ltd 70 Figure 6 6 Reflow profile Table 6 2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 40 C 150 C 60s 120s Heating rate 0 5 C s 2 C s Soak zone 150 C 200 C t1 t2 60s 120s Heating rate 1 0 C s Reflow zone 217 C t3 t4 30s 90s Peak reflow temperature 230 C 250 C Cooling zone Cooling rate 1 C s Slope 4 C s ...

Страница 71: ... but controllable in order to melt all the solder joints simultaneously Pay attention to protect the module PCB neighboring devices and their solder joints against heating or mechanical damages The LGA module has many solder pads and the pads are large Therefore common soldering irons and heat guns cannot be used in the rework Rework must be done using either infrared heating rework stations or ho...

Страница 72: ... is recommended that a fixture and a mini stencil be made to apply the solder paste in the rework 6 9 5 Module Installation Install the module precisely on the module and ensure the right installation direction of the module and the reliability of the electrical connection with the PCB It is recommended that the module be preheated in order to ensure that the temperature of all parts to be soldere...

Страница 73: ... Technologies Co Ltd 73 6 9 6 Specifications of Rework Temperature parameter of rework for either the removing or welding of the module the heating rate during the rework must be equal to or smaller than 3 C s and the peak temperature between 240 C 250 C The following parameters are recommended during the rework Figure 6 8 Temperature graph of rework ...

Страница 74: ... About This Chapter This chapter gives a general description of certifications of ME909 7 2 Certifications The certification of ME909 is testing now Table 7 1 shows certifications the ME909 will be implemented For more demands please contact us for more details about this information Table 7 1 Product Certifications Certification Model name ME909u 521 CE FCC CCC RoHS GCF PTCRB WEEE ...

Страница 75: ...oblems consult your service provider Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker If you are using an electronic medical device consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device 8 3 Area with Inflammables...

Страница 76: ...e the rules and regulations of airline companies When boarding or approaching a plane power off your wireless device Otherwise the radio signal of the wireless device may interfere with the plane control signals 8 6 Safety of Children Do not allow children to use the wireless device without guidance Small and sharp components of the wireless device may cause danger to children or cause suffocation...

Страница 77: ...ot leave your wireless device and accessories in a place with a considerably low or high temperature Use only accessories of the wireless device approved by the manufacture Contact the authorized service center for any abnormity of the wireless device or accessories Do not dismantle the wireless device or accessories Otherwise the wireless device and accessories are not covered by the warranty The...

Страница 78: ...ertified to the FCC that it does not exceed the limit established by the government adopted requirement for safe exposure This device complies with Part 15 of the FCC Rules Operation is subject to the following two conditions 1 this device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Warning Cha...

Страница 79: ...ies LTE LGA Module Hardware Guide Appendix A Circuit of Typical Interface Issue V0 3 2013 05 21 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 79 9 Appendix A Circuit of Typical Interface TBD ...

Страница 80: ...ration Partnership Project 8PSK 8 Phase Shift Keying AUX Auxiliary BER Bit Error Rate BLER Block Error Rate BIOS Basic Input Output System CCC China Compulsory Certification CE European Conformity CMOS Complementary Metal Oxide Semiconductor CTL Control CS Coding Scheme CSD Circuit Switched Data DC Direct Current DCE Data Communication Equipment DL Down Link DMA Direct Memory Access DTE Data Termi...

Страница 81: ...GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile Communication HSDPA High Speed Downlink Packet Access HSPA Enhanced High Speed Packet Access HSUPA High Speed Up link Packet Access ISO International Standards Organization JTAG Joint Test Action Group LCP Liquid Crystal Polyester LDO Low Dropout LED Light Emitting Diode LGA Land Grid Array MCP Multi chip ...

Страница 82: ...bstances SMS Short Message Service TBD To Be Determined TIS Total Isotropic Senstivity TRP Total Radiated Power TTFF Time to First Fix TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver Transmitter UL Up Link UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VIP Vendor IDentity VSWR Voltage Standing Wave Ratio WEEE...

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