Huawei eSpace EGW1520, Быстрый старт

Страница: 11 / 22

Seeking Technical Support and O
Declaration on Hazardous Substa
Products
Parts Hazardous Subst
Contact the device supplier to obtain tech
Technical support
Documentation
Obtain documentation from the CD-ROM
SUPPORT
>
Products
>
UC&C
>
UC
>
obtain documentation.
Parts Hazardous Subst
Pb Hg
Mechanical part
× ○
Board/circuit module × ○
Signal cable
× ○
Cable connector
× ○
Power adapter
× ○
Auxiliary equipment
× ○
○：
Indicates that the concentration of the haz
h t i l f thi t i b l th homogeneous materials of this part is below the
standard.
×：
Indicates that the concentration of the haz
homogeneous materials of this part is above the
1. Mechanical part such as shell: The steel, aluminum
2. Board and circuit module:
z
The PCB pad contains lead.
z
Ceramic capacitor or feedthrough capacitor or
ceramic chip contains lead.
z
The resistor inside the clock oscillator is immu
z
The high temperature type solder, used for the
contains more than 85% lead.
NOTE
1
contains more than 85% lead.
z
The luminescence glass of chip inductor contai
z
The high temperature type solder used for the t
z
The glass of resistance layer and protection lay
z
The pin and solder of the components such as t
3. Signal cables: The alloy materials such as the steel
contain lead.
4. Cable connector: For most connectors, the metal sh
5. Power adapter: The interior contains lead.
6.The circuit board of the auxiliary equipment contain
two.
Obtaining Documentation
ances in Electronic Information
tances
hnical support.
delivered with the device or choose
UC
in http://enterprise.huawei.com to
tances
Cd Cr6+ PBB PBDE
○ ○ ○ ○
○ ○ ○ ○
○ ○ ○ ○
○ ○ ○ ○
○ ○ ○ ○
○ ○ ○ ○
ardous substance contained in all the
li it i t f th SJ/T 11363 2006 e limit requirement of the SJ/T 11363 − 2006
ardous substance contained in all the
e limit requirement.
m or copper materials contain lead.
mica capacitor on the board: The
une from lead.
connector inside the transformer,
0
ins lead.
transistor chip contains lead.
yer is immune from lead.
the IC and power unit contain lead.
l, aluminum, and copper materials
hell, terminal and pin contain lead.
ns lead. Same as point one and point