HTC confidential
© 2004, HTC CORPORATION. ALL RIGHTS RESERVED. TOTAL
53
CONT.ON. 4 PAGE NO.
3
TABLE OF CONTENTS
CHAPTER 1 – INTRODUCTION .................................................................................................................................................... 5
1.1
P
RODUCTION
S
PECIFICATION
................................................................................................................................................... 5
CHAPTER 2 – SERVICEING TOOLS ............................................................................................................................................ 9
2.1
R
EPAIR
L
EVEL
D
EFINITION
...................................................................................................................................................... 9
2.2
L
IST OF
S
ERVICING
T
OOLS
........................................................................................................................................................ 9
CHAPTER 3 – ASSEMBLING AND DISASSEMBLING ............................................................................................................ 10
3.1
D
ISASSEMBLING
...................................................................................................................................................................... 10
3.2
A
SSEMBLING
............................................................................................................................................................................ 16
CHAPTER 4 – DIAGNOSTIC PROGRAM .................................................................................................................................. 21
4.1
L
IST OF
D
IAGNOSTIC
/
W
IN
CE
T
EST
I
TEMS
........................................................................................................................... 21
4.2
T
EST
P
ROCEDURE
.................................................................................................................................................................... 22
CHAPTER 5 –SOFTWARE UPGRADE PRCEDURE................................................................................................................. 24
5.1
RUU
(R
E
-
FLASH
U
PGRADE
U
TILITY
)
..................................................................................................................................... 24
5.2
SD
CARD UPGRADE
.................................................................................................................................................................. 28
CHAPTER 6 –LEAKAGE CURRENT MEASUREMENT.......................................................................................................... 30
BATTERY RUNDOWN TEST PROCEDURE .............................................................................................................................. 34
TEST
PROCEDURE
................................................................................................................................................................... 34
CHAPTER 7 – COSMETIC INSPECTION CRITERIA.............................................................................................................. 39
7.1
C
LASSES DEFINITION OF INSPECTIVE AREA
............................................................................................................................ 39
7.2.
M
AIN UNIT INSPECTION
.......................................................................................................................................................... 40
CHAPTER 8 –TROUBLESHOOTING AND REPAIR................................................................................................................. 41
CHAPTER 9 –GENERIC SPARE PART LIST ............................................................................................................................. 46
9.1
SPL
FOR
R
EPAIR
...................................................................................................................................................................... 46
9.2
B
OARD
L
EVEL
......................................................................................................................................................................... 47
9.3
FRU
M/B
ADDITIONAL PARTS LOCATION
............................................................................................................................... 47
APPENDIX........................................................................................................................................................................................ 49
A.
G
ENERIC
L
ABELING
P
LAN
....................................................................................................................................................... 50
B.
RF
A
NTENNA
T
EST
S
PECIFICATION
......................................................................................................................................... 51
