Doc. No.
DOC-00040948
REV.
Issued Date
2008/8/28
HTC Corporation
Revised Date
2008/8/28
A03
Doc. Title
Athena 1.5 Service Manual
Page
98 of 110
10.
B
OARD
L
EVEL
2.5
R
EPAIRS
Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
Warning
:
DO NOT overheat the tape and components to avoid the tape melted and make the
component damage.
Step 2 Use Heater Gun (HAKO850B, set the temperature between
350
, Air
℃
Speed 3~5) to remove the components.
Step 3 It has to wait the temperature cool down before the damaged components been removed. Or, the others
components could be gone when the solder-proof tape been taken off.
Step 4 After the damaged components has been replaced; clear the surroundings for solder and flux residues.
HTC CONFIDENTIAL