MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in
product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Star Head Screw Driver
M3
Cross Head Screw Driver
M3, M4
Plastic Nipper
Normal
Nut Driver
M4
Electric Iron
Normal
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the middle bezel and left panel.
2. Disconnect the battery connector, and press on/off button to discharge the rest electricity.
3. Loosen the screws fixing the battery door, remove the battery door, and pull out the battery.
4. Loosen the screws fixing the top cover, and remove the top cover.
5. Disconnect the LCD cable and front FAN cable connecting to control PCBA, loosen the screws fixing the right
panel ASSY, and remove the right panel ASSY .
6. Loosen the screws fixing the front FAN, and remove the front FAN.
7. Disconnect the cables connecting to Slot box, AVR, rear FAN, I/O PCBA, and rear panel ASSY, and disassemble
the cable clips sticking on the mainframe, and loosen the screws fixing the main PCBA, then remove the main
PCBA .
8. Loosen the screws fixing the rear panel ASSY, disconnect the cables connecting to the I/O PCBA, loosen the
nut fixing ground cable to the mainframe, and then remove the rear panel ASSY.
9. Cut off the cable tie, disconnect the cables connecting to I/O PCBA, loosen the nuts fixing the AVR, and then
remove the AVR.
10. Remove the RPO connector, loosen the screws fixing Slot box, COM PCBA, and rear FAN, and then remove the
Slot box, COM PCBA, and rear FAN.
11. Loosen the screws fixing I/O PCBA, and then remove the I/O PCBA.
12. Disassemble right panel ASSY into separate parts.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Full View
