MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torque Driver (Standard)
Torque Bit
T10
Torque Bit
T25
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove PULL OUT
2. Press handle and remove – 1 pc of BLANK FILLER
3. Press handle and remove – 1 Unit of Power Supply
4. Unscrew and remove – 2 units of FAN TRAY
5. Unscrew and remove – M5 SCREW at 1 location
6. Unscrew and remove – M3 SCREW at 16 Locations and CHASSIS COVER
7. Unplug and remove – CABLE connect between PCBA, MAIN BOARD and PCBA, FAN BRIDGING BOARD
8. Unplug – FFC CABLE from PCBA, LED BOARD
9. Unscrew and remove – M3 SCREW at 2 locations
10. Remove – PCBA, LED BOARD
11. Remove - PUSHBUTTON
12. Unscrew and remove – M3 SCREW at 4 Locations and PCBA, FAN BRIDGING BOARD
13. Unscrew and remove - M3 SCREW at 11 Locations and
PCBA, MAIN BOARD
14.
Remove -
COIN BATTERY from BATTERY SOCKET
15. Unplug – FFC CABLE from PCBA, MAIN BOARD
16. Remove - INSULATOR from CHASSIS
17. Remove - INSULATOR from CHASSIS
18. Remove – FRONT OVERLAY from CHASSIS
