Security
Power-on password
Administrator's password
Keyboard password (QuickLock)
HP iLO 4 On System Management Chipset with:
SSL encryption
Secure Shell version 2
Advanced Encryption Standard (AES) and Triple Data Encryption Standard (3DES) on browser,
CLP and XML scripting interface
AES and RC4 encryption of video
External USB port enable/disable
Network server mode
Serial interface control
TPM (Trusted Platform Module) 1.2 option
Advanced Encryption Standard (AES)
Intel® Advanced Encryption Standard-New Instructions (AES-NI)
Intet TXT (require the TPM module option)
Availability
Memory
Data Bus ECC protection provides automatic correction from a single data bit error and detection of
double data error bits. Often called single error correction/double error detection (SEC/DED).
Advanced ECC uses single device data correction (SDDC) to detect and correct single and all multi-bit
error that occurs within a single DRAM chip. Both x4 and x8 SDDC are supported (x8 requires
lockstep mode).
Memory online spare mode (also known as rank spare mode) detects a rank that is degrading and
switches operation to the spare rank. HP offers the rank sparing rather than DIMM sparing as rank
sparing uses less spare memory resulting in reduced overhead.
Memory lockstep mode is used to correct a single x8 DRAM device failure on a DIMM. The DIMMs in
each paired memory channel must have identical HP part numbers.
Memory demand and patrol scrubbing prevent accumulation of correctable errors and reducing the
likelihood of unplanned downtime.
Failed DIMM isolation improves the service time thus improving the overall system availability.
Address parity protection available on RDIMMs and LRDIMMs detects address bit errors to improve
service time and overall system availability.
Memory thermal control is used to prevent DIMMs from overheating. Achieved by slowing down the
memory access rate per the temperature monitored by DIMM sensor.
Mezzanine options and I/O
One or two FlexibleLOM connectors each supporting two (i.e. redundant) Ethernet ports routed to
redundant interconnect modules.
Multiple mezzanine I/O expansion slots that support a wide variety of mezzanine cards each
supporting multiple data paths routed to redundant interconnect modules.
Network Adapter Teaming (bonding) provides network fault tolerance, transmit load balancing, and
switch-assisted load balancing.
Storage
Two (2) hot-plug SAS/SATA/SSD drive bays.
Integrated HP Smart Array P220i Controller with 512MB FBWC capability, RAID 0 and 1, and
upgradeable firmware with recovery ROM capability.
NOTE:
The 512MB flash-backed write cache (FBWC) is included on pre-configured models and is
QuickSpecs
HP ProLiant BL660c Generation 8 (Gen8) Server Blade
Standard Features
DA - 14394 North America — Version 17 — December 16, 2013
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