EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
ink, including liquids, semi-liquids (gel/paste)
and toner
and service stations.
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver, Lever, Star Screwdriver(six)
NA
Slanted Pliers, Pliers
NA
Hammer
NA
Knife
NA
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. AIO PC
2. LCD
3. Thermal Fan
4. ODD
5. HDD
6. Keyboard
7. Mouse
8. Power Adapter and Cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Procedure
Part
Disassembly
Remark
No
Picture
No
Name
Picture
Material
Weight
(g)
Connection
Technique
Tool
Time
(s.)
A
1
Metal piece
Metal
1
Snap,
Adhesive,
Screwdriver,
Lever,
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