HP PAVILION G6, Руководство по техническому обслуживанию и ремонту

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2. Remove the PCH heat sink by lifting straight up (2) .
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, heat sink, processor, and system board spare part kits.
Reverse this procedure to install the PCH heat sink.
Processor
NOTE: The processor spare part kit includes replacement thermal material.
Description Spare part number
Intel Core i7-3632QM (2.2 GHz, SC turbo up to 3.1 GHz, 1600MHz/6 MB L3 cache, quad
core, 35 W)
701658-001
Intel Core i5-3230M (2.6 GHz, SC turbo up to 3.1 GHz, 1600 MHz/3 MB L3 cache, dual core,
35 W)
711903-001
Intel Core i5-3210M (2.5 GHz, SC turbo up to 3.1 GHz, 1600 MHz/3 MB L3 cache, dual core,
35 W)
680645-001
Intel Core i3-3130M (2.6 GHz, 1600 MHz/3 MB L3 cache, dual core, 35 W) 713163-001
Intel Core i3-3120M (2.5 GHz 1600 MHz/3 MB L3 cache, dual core, 35 W) 700627-001
Intel Core i3-3110M (2.4 GHz 1600 MHz/3 MB L3 cache, dual core, 35 W) 682417-001
Intel Core i5-2450M (2.5 GHz, SC turbo up to 3.10 GHz, 1333 MHz/3 MB L3 cache, dual
core, 35 W)
676359-001
Intel Core i3-2370M (2.4 GHz, 1333 MHz/3 MB L3 cache, dual core 35 W) 677152-001
84 Chapter 4 Removal and replacement procedures ENWW