7.
Remove the fan/heat sink assembly
(2)
.
The thermal material must be thoroughly cleaned from the surface of the processor component
(1)
and
the fan/heat sink assembly
(2)
each time the fan/heat sink assembly is removed. Thermal pads and
thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled.
NOTE:
Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with UMA graphics
subsystems.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
89
Содержание Pavilion dm4
Страница 1: ...HP Pavilion dm4 Entertainment PC Maintenance and Service Guide ...
Страница 4: ...iv MSG revision history ...
Страница 6: ...vi Safety warning notice ...
Страница 10: ...x ...
Страница 15: ...Mini card device SIM 5 ...
Страница 29: ...Computer major components Computer major components 19 ...
Страница 122: ...Universal Serial Bus Pin Signal 1 5 VDC 2 Data 3 Data 4 Ground 112 Chapter 8 Connector pin assignments ...
Страница 135: ......