HP PAVILION DM3, Руководство по техническому обслуживанию и ремонту

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4–36 Maintenance and Service Guide
Removal and replacement procedures
Heat sink
✎
The processor is soldered onto the system board. Thermal grease has been applied between the heat sink and the
processor, chipset, and graphics chipset.
Before removing the heat sink, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on,
and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet, and then
unplugging the AC adapter from the computer.
4. Remove the battery (see “Battery” on page 4-6 ).
5. Remove the following components:
a. Hard drive (see “Hard drive” on page 4-9 )
b. Memory/wireless module compartment cover (see “WLAN module” on page 4-12 )
c. Keyboard (see “Keyboard” on page 4-16 )
d. Display assembly (see “Display assembly” on page 4-22 )
e. Top cover (see “Top cover” on page 4-19 )
f. System board (see “System board” on page 4-33 )
Remove the heat sink:
1. Loosen the four captive Phillips 2.0×8.0 screws
1
in the order sequence noted on the heat sink.
2. Remove the five Phillips 2.0×4.0 screws
2
holding the heat sink to the system board.
3. Remove the heat sink
3
.
Reverse this procedure to install the heat sink.
Description Spare part number
Heat sink for use only on computer models equipped with a graphics subsystem with
discrete memory 581187-001
Heat sink for use only on computer models equipped with a graphics subsystem with
UMA memory 581186-001