HP-00007-01, Appendix 3 13-Oct-2004
Page 2
2.0 Tools
Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
1
2
3
4
Item
Tool Description
Tool Size (if applicable)
1
Philip Screw Driver
000X40
2
Torex Screw Driver
T6X40
3
Special Made Plastic Stick
4 Tweezers
3.0 Product
Disassembly
Process
3.1
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
Step Description
Time Required
(Second)
1
Remove the stylus, SD card, battery cover, antenna and main battery.
35
2
Remove the 4 screws.
35
3
Separate housing and bezel, remove the vibrator.
30
4
Disconnect all the FPCs and cables from the connectors of M/B.
80
5
Remove the screws on speaker carrier and remove the carrier
30
6
Remove the M/B PCA from the bezel. Remove coin cell battery for
selective treatment.
20
3.2
OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below: