b.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and the
system board components, it may be necessary to move the heat sink from side to side to detach
it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material
is included with the heat sink, processor, and system board spare part kits.
NOTE:
For discrete models, thoroughly clean thermal material from the surfaces of the system board
components each time you remove the heat sink. Thermal paste is used on the processor
(1)
and the
heat sink section
(2)
that services it. A thermal pad is used on the Northbridge chip
(3)
and the heat sink
section
(4)
that services it. All heat sink and processor spare part kits include thermal material.
UMA models:
a.
Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four Phillips PM2.0×4.5
screws
(1)
that secure the heat sink to the system board.
64
Chapter 6 Removal and replacement procedures for Authorized Service Provider parts