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NOTE:
Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with UMA graphics
subsystems.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly
(1)
and
(3)
, and the processor component
(2)
, each time the fan/heat sink assembly is removed. Thermal
pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is
reinstalled.
The following illustration shows the locations for thermal material on systems with discrete graphics
subsystems.
80
Chapter 4 Removal and replacement procedures
Содержание G62-300 - Notebook PC
Страница 4: ...iv Safety warning notice ...
Страница 6: ...vi MSG revision history ...
Страница 10: ...10 Recycling 114 Battery 114 Display 114 Index 121 x ...
Страница 27: ...Computer major components Computer major components 17 ...
Страница 70: ...Reverse this procedure to install the speaker assembly 60 Chapter 4 Removal and replacement procedures ...
Страница 76: ...Reverse this procedure to install the USB board 66 Chapter 4 Removal and replacement procedures ...
Страница 121: ...Universal Serial Bus Pin Signal 1 5 VDC 2 Data 3 Data 4 Ground Universal Serial Bus 111 ...
Страница 130: ...22 Remove the LCD panel 23 Recycle the LCD panel and backlight 120 Chapter 10 Recycling ...
Страница 135: ......