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Cooling
Requirements
The VXIbus Specification requires module manufacturers to establish a
cooling specification for each of their modules. The specification is to
consist of: (1) the airflow required (in liters/second) for adequate cooling,
and (2) the pressure drop that occurs across the module when the specified
airflow is applied.
Note
It is the user’s responsibility to furnish adequate cooling for any module to
be used in a VXIbus system. Module cooling requirements are described in
the VXIbus Specification (Rev 1.3) in Section B.7.2.4. Mainframe cooling
requirements are discussed in Section B.7.3.5.
For ease of integration, you should label the airflow requirements for your
finished application circuitry on the module. For example, the label might
read: 0.3 liters/sec @ 0.2 mm/H
2
O.
Due to the nature of a breadboard module, it is not possible to specify
cooling requirements without knowing the application and the amount of
power to be dissipated. Given the application, however, cooling
requirements may be estimated as follows:
1. Determine the airflow required as a function of power dissipation. To
maintain a 10ºC rise, approximately 0.08 liters/second are required
for every watt dissipated. For example, if a module dissipates 20
watts, 1.6 liter/second of airflow is required for cooling.
2. Establish the relationship between airflow and pressure drop. For a
breadboard loaded with typical components (such as ICs, relays, and
a few heat sinks), the curve in Figure 2-3 may be used to determine
the pressure drop across the module. Determine the pressure drop as
the intersection of the curve and the required airflow. For example, if
the airflow required is 1.6 liter/second, the pressure drop across a
typically populated breadboard will be approximately 0.05 mm H
2
O.
Figure 2-3. Pressure vs. Airflow
Chapter 2
Configuring the HP E1399A 19
Содержание E1399A
Страница 6: ...Notes 6 HP E1399A Register Based Breadboard Module User s Manual ...
Страница 8: ...8 HP E1399A Register Based Breadboard Module User s Manual ...
Страница 11: ...Figure 1 1 Digital Backplane Interface Block Diagram Chapter 1 HP E1399A Introduction 11 ...
Страница 14: ...14 HP E1399A Introduction Chapter 1 ...
Страница 17: ...Figure 2 1 HP E1399A Breadboard Module Connector Pinout Chapter 2 Configuring the HP E1399A 17 ...
Страница 18: ...Figure 2 2 HP E1399A Dimensions 18 Configuring the HP E1399A Chapter 2 ...
Страница 21: ...Figure 2 5 Terminal Module Installation Chapter 2 Configuring the HP E1399A 21 ...
Страница 40: ...Figure 3 2 Timing for Reading the Status Register 40 Using the HP E1399A Chapter 3 ...
Страница 43: ...Figure 3 4 Timing for Writing to the Control Register Chapter 3 Using the HP E1399A 43 ...
Страница 45: ...Figure 3 5 Interrupt Timing Chapter 3 Using the HP E1399A 45 ...
Страница 46: ...Figure 3 6 Interrupt Timing Wrong IRQ Level or No Interrupts Pending 46 Using the HP E1399A Chapter 3 ...
Страница 53: ...Appendix B HP E1399A Parts List Schematic 53 ...
Страница 54: ...Figure B 1 HP E1399A Breadboard Schematic 1 of 2 54 HP E1399A Parts List Schematic Appendix B ...
Страница 55: ...Figure B 1 HP E1399A Breadboard Schematic 2 of 2 Appendix B HP E1399A Parts List Schematic 55 ...
Страница 56: ...56 HP E1399A Parts List Schematic Appendix B ...