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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed:
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal pads are used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
Replacement thermal material is included with all fan/heat sink assembly, system board, and
processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
67
Содержание DV3
Страница 1: ...HP Pavilion dv3 Entertainment PC Maintenance and Service Guide ...
Страница 4: ...iv MSG revision history ...
Страница 6: ...vi Safety warning notice ...
Страница 10: ...x ...
Страница 25: ...Computer major components Computer major components 15 ...
Страница 81: ...Reverse this procedure to install the optical drive connector board Component replacement procedures 71 ...
Страница 116: ...workstation guidelines 34 106 Index ...