HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
Page 3
22
Remove logic lower.
23
Remove two M2.5*4L screws on audio board.
24
Remove the audio board
25
Remove one M2.5*4L screw on speaker box.
26
Remove one M2.5*4L screw on M/B
27
Pull out the audio board wire /DC-IN wire
28
Remove two M2*3L screws on Bluetooth module.
29
Remove Bluetooth module and pull out B/T module wire
30
Pull out the RJ-11 jack from hinge saddle.
31
Release the adhesive on T/P support bracket above speaker wire.
32
Remove M/B from logic up
33
Release the wire connector of fan module
34
Remove one M2*3L screw on hinge saddle
35
Remove two M2.5*5L screws on hinge saddle around CRT connector
36
Remove two I-HEAD screws around CABLE-DOCKING connector
37
Remove hinge saddle from M/B
38
Disassemble LCD module and remove mercury bulb for selective treatment
3.2
OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
