HP Compaq Presario V5000 Series, Инструкции по разборке устройства в конце срока службы

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HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
Page 2
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-Phillip #1
Screwdriver Type-Phillip #0
C nnmm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove 6 cell battery
2 Remove one capture screws on RAM door and release the RAM door
3 Remove the Mini-PCI card
4 Remove RTC coin cell battery on MB for selective treatment
5 Remove one M2.5*4L screw on RAM door housing
6 Remove the ODD module
7 Remove two capture screws on HDD door and release HDD door
8 Remove the HDD module
9 Remove two M2*4L screws on battery housing which be indicated by triangle mark on
logic lower
10 Remove the strip cover
11 Remove four M2.5*4L screws on the front side of keyboard.
12 Remove the keyboard module
13 Remove four M2.5*8L screws on hinge cap.
14 Release the connector of LCD wire set.
15 Remove two M2.5*12L screws on logic low near hinge side.
16 Remove the LCD module.
17 Remove two M2.5*12L screws on logic up within Keyboard area.
18 Remove three M2.5*4L screws on logic low within Battery housing.
19 Remove two M2.5*4L and one M2.5*12L screws on logic low within HDD module housing
20 Remove two M2.5*12L screws on logic low within RAM module housing
21 Remove eight M2.5*12L screws on logic low.